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SKIIP23AC12T4V1 PDF预览

SKIIP23AC12T4V1

更新时间: 2024-11-13 20:50:19
品牌 Logo 应用领域
赛米控丹佛斯 - SEMIKRON 局域网功率控制晶体管
页数 文件大小 规格书
5页 328K
描述
Insulated Gate Bipolar Transistor, 41A I(C), 1200V V(BR)CES, N-Channel, MINISKIIP 1, 42 PIN

SKIIP23AC12T4V1 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:FLANGE MOUNT, R-XUFM-X42针数:42
Reach Compliance Code:compliant风险等级:5.64
其他特性:UL RECOGNIZED, HIGH RELIABILITY外壳连接:ISOLATED
最大集电极电流 (IC):41 A集电极-发射极最大电压:1200 V
配置:BRIDGE, 6 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR门极-发射极最大电压:20 V
JESD-30 代码:R-XUFM-X42元件数量:6
端子数量:42最高工作温度:175 °C
封装主体材料:UNSPECIFIED封装形状:RECTANGULAR
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL认证状态:Not Qualified
子类别:Insulated Gate BIP Transistors表面贴装:NO
端子形式:UNSPECIFIED端子位置:UPPER
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:POWER CONTROL
晶体管元件材料:SILICON标称断开时间 (toff):392 ns
标称接通时间 (ton):90 nsVCEsat-Max:2.1 V
Base Number Matches:1

SKIIP23AC12T4V1 数据手册

 浏览型号SKIIP23AC12T4V1的Datasheet PDF文件第2页浏览型号SKIIP23AC12T4V1的Datasheet PDF文件第3页浏览型号SKIIP23AC12T4V1的Datasheet PDF文件第4页浏览型号SKIIP23AC12T4V1的Datasheet PDF文件第5页 
SKiiP 23AC12T4V1  
Absolute Maximum Ratings  
Symbol Conditions  
Inverter - IGBT  
Values  
Unit  
Tj = 25 °C  
VCES  
IC  
1200  
41  
34  
25  
75  
V
A
A
A
A
V
Ts = 25 °C  
Ts = 70 °C  
Tj = 175 °C  
ICnom  
ICRM  
VGES  
ICRM = 3 x ICnom  
VCC = 800 V  
-20 ... 20  
MiniSKiiP® 2  
V
V
GE 15 V  
CES 1200 V  
Tj = 150 °C  
tpsc  
10  
µs  
°C  
Tj  
-40 ... 175  
Inverse - Diode  
Ts = 25 °C  
Ts = 70 °C  
IF  
32  
26  
25  
75  
100  
A
A
A
A
A
Tj = 175 °C  
SKiiP 23AC12T4V1  
Features  
IFnom  
IFRM  
IFSM  
Tj  
IFRM = 3xIFnom  
10 ms, sin 180°, Tj = 150 °C  
• Trench 4 IGBT´s  
-40 ... 175  
°C  
• Robust and soft freewheeling diodes in  
CAL technology  
Module  
It(RMS)  
Tstg  
• Highly reliable spring contacts for  
electrical connections  
Tterminal = 80 °C, 20A per spring  
AC sinus 50Hz, t = 1 min  
100  
-40 ... 125  
2500  
A
°C  
V
• UL recognised file no. E63532  
Visol  
Remarks  
Characteristics  
• VCEsat , VF= chip level value  
Symbol Conditions  
Inverter - IGBT  
min.  
typ.  
max.  
Unit  
• Case temp. limited to TC= 125°C max.  
(for baseplateless modules TC = TS)  
• product rel. results valid for Tj150  
(recomm. Top = -40 ... +150°C)  
IC = 25 A  
Tj = 25 °C  
VCE(sat)  
1.85  
2.25  
2.10  
2.45  
V
V
V
GE = 15 V  
Tj = 150 °C  
chiplevel  
Tj = 25 °C  
Tj = 150 °C  
Tj = 25 °C  
Tj = 150 °C  
VCE0  
rCE  
0.8  
0.7  
42  
62  
5.8  
0.1  
0.9  
0.8  
48  
66  
6.5  
0.3  
V
V
m  
m  
V
mA  
mA  
nF  
nF  
nF  
nC  
VGE = 15 V  
VGE = VCE, IC = 1 mA  
VGE(th)  
ICES  
5
Tj = 25 °C  
VGE = 0 V  
V
CE = 1200 V  
f = 1 MHz  
f = 1 MHz  
f = 1 MHz  
Cies  
Coes  
Cres  
QG  
RGint  
td(on)  
tr  
Eon  
td(off)  
tf  
Eoff  
Rth(j-s)  
1.43  
0.12  
0.09  
142  
0.00  
44  
VCE = 25 V  
GE = 0 V  
V
- 8 V...+ 15 V  
Tj = 25 °C  
VCC = 600 V  
Tj = 150 °C  
Tj = 150 °C  
Tj = 150 °C  
Tj = 150 °C  
Tj = 150 °C  
Tj = 150 °C  
ns  
ns  
mJ  
ns  
ns  
I
C = 25 A  
46  
R
R
G on = 39   
G off = 39   
3.7  
330  
62  
2.4  
1
di/dton = 465 A/µs  
di/dtoff = 350 A/µs  
V
GE = +15/-15 V  
mJ  
K/W  
per IGBT  
AC  
© by SEMIKRON  
Rev. 4 – 02.12.2011  
1

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