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SKIIP2403GB122-4DW PDF预览

SKIIP2403GB122-4DW

更新时间: 2024-11-12 22:43:11
品牌 Logo 应用领域
赛米控丹佛斯 - SEMIKRON /
页数 文件大小 规格书
2页 113K
描述
2-pack-integrated intelligent Power System

SKIIP2403GB122-4DW 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:,Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8542.39.00.01
风险等级:5.84内置保护:TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE
接口集成电路类型:HALF BRIDGE BASED PERIPHERAL DRIVERJESD-30 代码:R-XXMA-X
JESD-609代码:e2功能数量:4
最高工作温度:85 °C最低工作温度:-40 °C
输出电流流向:SOURCE AND SINK标称输出峰值电流:2500 A
封装主体材料:UNSPECIFIED封装形状:RECTANGULAR
封装形式:MICROELECTRONIC ASSEMBLY峰值回流温度(摄氏度):NOT SPECIFIED
认证状态:Not Qualified最大供电电压:30 V
最小供电电压:13 V标称供电电压:24 V
表面贴装:NO温度等级:INDUSTRIAL
端子面层:Tin/Silver (Sn/Ag)端子形式:UNSPECIFIED
端子位置:UNSPECIFIED处于峰值回流温度下的最长时间:NOT SPECIFIED
Base Number Matches:1

SKIIP2403GB122-4DW 数据手册

 浏览型号SKIIP2403GB122-4DW的Datasheet PDF文件第2页 
SKiiP 2403GB122-4DW  
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2-pack-integrated  
intelligent Power System  
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Characteristics  
Symbol Conditions  
IGBT  
SKiiP 2403GB122-4DW  
Preliminary Data  
min.  
typ.  
max.  
Units  
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Thermal characteristics (NWK40; 8l/min; 50%glycol); "s" reference to heat  
sink; "r" reference to built-in temperature sensor  
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This technical information specifies semiconductor devices but promises no  
characteristics. No warranty or guarantee, expressed or implied is made regarding  
delivery, performance or suitability.  
Case S43  
1
05-04-2005 GIL  
© by SEMIKRON  

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