SiHG40N60E
Vishay Siliconix
www.vishay.com
24
20
16
12
8
40
30
20
10
0
VDS = 480 V
VDS = 300 V
DS = 120 V
V
4
0
0
50
100
150
200
250
25
50
75
100
125
150
Qg, Total Gate Charge (nC)
TC, Case Temperature (°C)
Fig. 7 - Typical Gate Charge vs. Gate-to-Source Voltage
Fig. 10 - Maximum Drain Current vs. Case Temperature
750
725
700
675
650
625
600
100
TJ = 150 °C
10
TJ = 25 °C
1
575
ID = 250 μA
VGS = 0 V
1.2 1.4
0.1
550
0.2
0.4
0.6
0.8
1.0
-60 -40 -20
0
20 40 60 80 100 120 140 160
VSD, Source-Drain Voltage (V)
TJ, Junction Temperature (°C)
Fig. 8 - Typical Source-Drain Diode Forward Voltage
Fig. 11 - Temperature vs. Drain-to-Source Voltage
Operation in this area
Limited by RDS(on)
IDM limited
100
10
100 μs
1 ms
Limited by RDS(on)
*
1
10 ms
0.1
0.01
TC = 25 °C
TJ = 150 °C
Single pulse
BVDSS limited
1
10
100
1000
VDS, Drain-to-Source Voltage (V)
* VGS > minimum VGS at which RDS(on) is specified
Fig. 9 - Maximum Safe Operating Area
S16-0659-Rev. A, 18-Apr-16
Document Number: 91802
4
For technical questions, contact: hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000