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SIHFUC20-E3 PDF预览

SIHFUC20-E3

更新时间: 2024-11-25 12:14:51
品牌 Logo 应用领域
威世 - VISHAY 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
8页 1824K
描述
Power MOSFET

SIHFUC20-E3 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:TO-251
包装说明:IN-LINE, R-PSIP-T3针数:3
Reach Compliance Code:unknown风险等级:5.16
Is Samacsys:N其他特性:AVALANCHE RATED
雪崩能效等级(Eas):74 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:600 V
最大漏极电流 (Abs) (ID):2 A最大漏极电流 (ID):2 A
最大漏源导通电阻:4.4 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-251JESD-30 代码:R-PSIP-T3
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:IN-LINE峰值回流温度(摄氏度):260
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):42 W
最大脉冲漏极电流 (IDM):8 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:NO
端子面层:Matte Tin (Sn)端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:40
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

SIHFUC20-E3 数据手册

 浏览型号SIHFUC20-E3的Datasheet PDF文件第2页浏览型号SIHFUC20-E3的Datasheet PDF文件第3页浏览型号SIHFUC20-E3的Datasheet PDF文件第4页浏览型号SIHFUC20-E3的Datasheet PDF文件第5页浏览型号SIHFUC20-E3的Datasheet PDF文件第6页浏览型号SIHFUC20-E3的Datasheet PDF文件第7页 
IRFRC20, IRFUC20, SiHFRC20, SiHFUC20  
Vishay Siliconix  
Power MOSFET  
FEATURES  
• Dynamic dV/dt Rating  
PRODUCT SUMMARY  
VDS (V)  
600  
Available  
• Repetitive Avalanche Rated  
RoHS*  
• Surface Mount (IRFRC20/SiHFRC20)  
COMPLIANT  
R
DS(on) (Ω)  
VGS = 10 V  
4.4  
Qg (Max.) (nC)  
18  
3.0  
• Straight Lead (IRFUC20/SiHFUC20)  
• Available in Tape and Reel  
• Fast Switching  
Q
Q
gs (nC)  
gd (nC)  
8.9  
Configuration  
Single  
• Ease of Paralleling  
• Lead (Pb)-free Available  
D
DPAK  
(TO-252)  
IPAK  
(TO-251)  
DESCRIPTION  
Third generation Power MOSFETs from Vishay provide the  
designer with the best combination of fast switching,  
ruggedized device design, low on-resistance and  
cost-effectiveness.  
G
The D PAK is designed for surface mounting using vapor  
phase, infrared, or wave soldering techniques. The straight  
lead version (IRFUC/SiHFUC series) is for through-hole  
mounting applications. Power dissipation levels up to 1.5 W  
are possible in typical surcace mount applications.  
S
N-Channel MOSFET  
ORDERING INFORMATION  
Package  
DPAK (TO-252)  
IRFRC20PbF  
SiHFRC20-E3  
IRFRC20  
DPAK (TO-252)  
IRFRC20TRLPbFa  
SiHFRC20TL-E3a  
IRFRC20TRLa  
DPAK (TO-252)  
IRFRC20TRPbFa  
SiHFRC20T-E3a  
IRFRC20TRa  
DPAK (TO-252)  
IRFRC20TRRPbFa  
SiHFRC20TR-E3a  
IRFRC20TRRa  
IPAK (TO-251)  
IRFUC20PbF  
SiHFUC20-E3  
IRFUC20  
Lead (Pb)-free  
SnPb  
SiHFRC20  
SiHFRC20TLa  
SiHFRC20Ta  
SiHFRC20TRa  
SiHFUC20  
Note  
a. See device orientation.  
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted  
PARAMETER  
SYMBOL  
LIMIT  
600  
20  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
V
VGS  
T
C = 25 °C  
2.0  
Continuous Drain Current  
V
GS at 10 V  
ID  
TC =100°C  
1.3  
A
Pulsed Drain Currenta  
IDM  
8.0  
Linear Derating Factor  
0.33  
0.020  
450  
2.0  
W/°C  
Linear Derating Factor (PCB Mount)e  
Single Pulse Avalanche Energyb  
Repetitive Avalanche Currenta  
EAS  
IAR  
mJ  
A
Repetitive Avalanche Energya  
EAR  
4.2  
mJ  
Maximum Power Dissipation  
Maximum Power Dissipation (PCB Mount)e  
Peak Diode Recovery dV/dtc  
TC = 25 °C  
42  
PD  
W
V/ns  
°C  
TA = 25 °C  
2.5  
dV/dt  
3.0  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)  
TJ, Tstg  
- 55 to + 150  
260d  
for 10 s  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).  
b. VDD = 50 V, starting TJ = 25 °C, L = 206 mH, RG = 25 Ω, IAS = 2.0 A (see fig. 12).  
c. ISD 2.0 A, dI/dt 40 A/µs, VDD VDS, TJ 150 °C.  
d. 1.6 mm from case.  
e. When mounted on 1" square PCB (FR-4 or G-10 material).  
* Pb containing terminations are not RoHS compliant, exemptions may apply  
Document Number: 91285  
S-81392-Rev. A, 07-Jul-08  
www.vishay.com  
1

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