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SIHFZ14L PDF预览

SIHFZ14L

更新时间: 2024-11-25 11:57:31
品牌 Logo 应用领域
威世 - VISHAY 晶体晶体管功率场效应晶体管开关脉冲
页数 文件大小 规格书
9页 304K
描述
Power MOSFET

SIHFZ14L 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Active零件包装代码:TO-262AA
包装说明:IN-LINE, R-PSIP-T3针数:3
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8541.29.00.95风险等级:5.1
Is Samacsys:N其他特性:HIGH RELIABILITY, ULTRA-LOW RESISTANCE
雪崩能效等级(Eas):47 mJ配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:60 V最大漏极电流 (Abs) (ID):10 A
最大漏极电流 (ID):10 A最大漏源导通电阻:0.2 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-262AA
JESD-30 代码:R-PSIP-T3JESD-609代码:e0
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:175 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:IN-LINE峰值回流温度(摄氏度):240
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):43 W
最大脉冲漏极电流 (IDM):40 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:NO
端子面层:Tin/Lead (Sn/Pb)端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:30
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

SIHFZ14L 数据手册

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IRFZ14S, IRFZ14L, SiHFZ14S, SiHFZ14L  
Vishay Siliconix  
Power MOSFET  
FEATURES  
PRODUCT SUMMARY  
VDS (V)  
Halogen-free According to IEC 61249-2-21  
Definition  
60  
• Advanced Process Technology  
RDS(on) ()  
VGS = 10 V  
0.20  
• Surface Mount (IRFZ14S, SiHFZ14S)  
• Low-Profile Through-Hole (IRFZ14L, SiHFZ14L)  
• 175 °C Operating Temperature  
• Fast Switching  
• Compliant to RoHS Directive 2002/95/EC  
Qg (Max.) (nC)  
11  
3.1  
Q
Q
gs (nC)  
gd (nC)  
5.8  
Configuration  
Single  
DESCRIPTION  
Third generation Power MOSFETs from Vishay utilize  
advanced processing techniques to achieve extermely low  
D
D2PAK (TO-263)  
I2PAK (TO-262)  
on resistance per silicon area. This benefit, combined with  
the fast switching speed and ruggedized device design that  
Power MOSFETs are well known for, provides the designer  
with an extermely efficient reliabel deviece for use in a wide  
variety of applications.  
G
G
D
S
The D2PAK is a surface mount power package capable of  
accommodating die sizes up to HEX-4. It provides the  
D
S
G
highest power capability and lowest possible on-resistance  
in any existing surface mount package. The D2PAK is  
suitable for high current applications because of its low  
internal connection resistance and can dissipate up to 2.0 W  
in a typical surface mount application.  
S
N-Channel MOSFET  
The through-hole version (IRFZ14L, SiHFZ44L) is available  
for low profile applications.  
ORDERING INFORMATION  
Package  
Lead (Pb)-free and Halogen-free  
D2PAK (TO-263)  
SiHFZ14S-GE3  
IRFZ14SPbF  
D2PAK (TO-263)  
SiHFZ14STRL-GE3a  
IRFZ14STRLPbFa  
SiHFZ14STL-E3a  
I2PAK (TO-262)  
SiHFZ14L-GE3  
IRFZ14LPbF  
Lead (Pb)-free  
SiHFZ14S-E3  
SiHFZ14L-E3  
Note  
a. See device orientation.  
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)  
PARAMETER  
Drain-Source Voltage  
Gate-Source Voltage  
SYMBOL  
VDS  
LIMIT  
60  
20  
UNIT  
V
VGS  
T
C = 25 °C  
10  
7.2  
40  
Continuous Drain Current  
VGS at 10 V  
ID  
TC = 100 °C  
A
Pulsed Drain Currenta  
IDM  
Linear Derating Factor  
Single Pulse Avalanche Energyb  
Maximum Power Dissipation  
Maximum Power Dissipation (PCB Mount)e  
Peak Diode Recovery dV/dtc  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)  
0.29  
47  
43  
3.7  
4.5  
W/°C  
mJ  
EAS  
PD  
TC = 25 °C  
TA = 25 °C  
W
V/ns  
°C  
dV/dt  
TJ, Tstg  
- 55 to + 175  
300d  
for 10 s  
Notes  
b. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).  
c. VDD = 25 V, starting TJ = 25 °C, L = 548 μH, Rg = 25 , IAS = 10 A (see fig. 12).  
d. ISD 10 A, dI/dt 90 A/μs, VDD VDS, TJ 175 °C.  
e. 1.6 mm from case.  
f. When mounted on 1" square PCB (FR-4 or G-10 material).  
* Pb containing terminations are not RoHS compliant, exemptions may apply  
Document Number: 90365  
S11-1063-Rev. C, 30-May-11  
www.vishay.com  
1
This document is subject to change without notice.  
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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