IRFZ24S, IRFZ24L, SiHFZ24S, SiHFZ24S
Vishay Siliconix
Power MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
• Halogen-free According to IEC 61249-2-21
Definition
• Advanced Process Technology
• Surface Mount (IRFZ24S, SiHFZ24S)
• Low-ProfileThrough-Hole (IRFZ24L, SiHFZ24L)
• 175 °C Operating Temperature
• Fast Switching
60
RDS(on) ()
VGS = 10 V
0.10
Qg (Max.) (nC)
25
5.8
Q
Q
gs (nC)
gd (nC)
11
• Compliant to RoHS Directive 2002/95/EC
Configuration
Single
DESCRIPTION
Third generation Power MOSFETs from Vishay utilize
D
advanced processing techniques to achieve extremely low
on-resistance per silicon area. This benefit, combined with
the fast switching speed and ruggedized device design that
Power MOSFETs are well known for, provides the designer
with an extremely efficient and reliable device for use in a
wide variety of applications.
D2PAK (TO-263)
I2PAK (TO-262)
G
G
D
S
The D2PAK is a surface mount power package capable of
accommodating die size up to HEX-4. It provides the highest
power capability and the last lowest possible on-resistance
in any existing surface mount package. The D2PAK is
suitable for high current applications because of its low
internal connection resistance and can dissipate up to 2.0 W
in a typical surface mount application. The through-hole
version (IRFZ24L, SiHFZ24L) is available for low-profile
applications.
D
S
G
S
N-Channel MOSFET
ORDERING INFORMATION
Package
Lead (Pb)-free and Halogen-free
D2PAK (TO-263)
SiHFZ24S-GE3
IRFZ24SPbF
D2PAK (TO-263)
SiHFZ24STRR-GE3
-
-
I2PAK (TO-262)
-
IRFZ24LPbF
SiHFZ24L-E3
Lead (Pb)-free
SiHFZ24S-E3
Note
a. See device orientation.
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER
Drain-Source Voltage
Gate-Source Voltage
SYMBOL
VDS
LIMIT
60
20
UNIT
V
VGS
T
C = 25 °C
17
12
68
Continuous Drain Current
VGS at 10 V
ID
A
TC = 100 °C
Pulsed Drain Currenta, e
IDM
Linear Derating Factor
0.40
100
60
3.7
W/°C
mJ
Single Pulse Avalanche Energyb, e
EAS
PD
T
C = 25 °C
Maximum Power Dissipation
W
V/ns
°C
TA = 25 °C
Peak Diode Recovery dV/dtc, e
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
dV/dt
TJ, Tstg
4.5
- 55 to + 175
300d
for 10 s
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. VDD = 25 V, starting TJ = 25 °C, L = 400 μH, Rg = 25 , IAS = 17 A (see fig. 12).
c. ISD 17 A, dI/dt 140 A/μs, VDD VDS, TJ 175 °C.
d. 1.6 mm from case.
e. Uses IRFZ24, SiHFZ24 data and test conditions.
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 90366
S11-1063-Rev. C, 30-May-11
www.vishay.com
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000