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SIHFZ24STRR-GE3 PDF预览

SIHFZ24STRR-GE3

更新时间: 2024-11-09 09:25:27
品牌 Logo 应用领域
威世 - VISHAY 晶体晶体管功率场效应晶体管开关脉冲
页数 文件大小 规格书
9页 429K
描述
Power MOSFET

SIHFZ24STRR-GE3 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:D2PAK
包装说明:SMALL OUTLINE, R-PSSO-G2针数:4
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8541.29.00.95风险等级:5.09
Is Samacsys:N其他特性:ULTRA-LOW RESISTANCE
雪崩能效等级(Eas):100 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:60 V
最大漏极电流 (Abs) (ID):17 A最大漏极电流 (ID):17 A
最大漏源导通电阻:0.1 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-263ABJESD-30 代码:R-PSSO-G2
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE最高工作温度:175 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):60 W
最大脉冲漏极电流 (IDM):68 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子形式:GULL WING端子位置:SINGLE
处于峰值回流温度下的最长时间:40晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

SIHFZ24STRR-GE3 数据手册

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IRFZ24S, IRFZ24L, SiHFZ24S, SiHFZ24S  
Vishay Siliconix  
Power MOSFET  
FEATURES  
PRODUCT SUMMARY  
VDS (V)  
Halogen-free According to IEC 61249-2-21  
Definition  
• Advanced Process Technology  
• Surface Mount (IRFZ24S, SiHFZ24S)  
• Low-ProfileThrough-Hole (IRFZ24L, SiHFZ24L)  
• 175 °C Operating Temperature  
• Fast Switching  
60  
RDS(on) ()  
VGS = 10 V  
0.10  
Qg (Max.) (nC)  
25  
5.8  
Q
Q
gs (nC)  
gd (nC)  
11  
• Compliant to RoHS Directive 2002/95/EC  
Configuration  
Single  
DESCRIPTION  
Third generation Power MOSFETs from Vishay utilize  
D
advanced processing techniques to achieve extremely low  
on-resistance per silicon area. This benefit, combined with  
the fast switching speed and ruggedized device design that  
Power MOSFETs are well known for, provides the designer  
with an extremely efficient and reliable device for use in a  
wide variety of applications.  
D2PAK (TO-263)  
I2PAK (TO-262)  
G
G
D
S
The D2PAK is a surface mount power package capable of  
accommodating die size up to HEX-4. It provides the highest  
power capability and the last lowest possible on-resistance  
in any existing surface mount package. The D2PAK is  
suitable for high current applications because of its low  
internal connection resistance and can dissipate up to 2.0 W  
in a typical surface mount application. The through-hole  
version (IRFZ24L, SiHFZ24L) is available for low-profile  
applications.  
D
S
G
S
N-Channel MOSFET  
ORDERING INFORMATION  
Package  
Lead (Pb)-free and Halogen-free  
D2PAK (TO-263)  
SiHFZ24S-GE3  
IRFZ24SPbF  
D2PAK (TO-263)  
SiHFZ24STRR-GE3  
-
-
I2PAK (TO-262)  
-
IRFZ24LPbF  
SiHFZ24L-E3  
Lead (Pb)-free  
SiHFZ24S-E3  
Note  
a. See device orientation.  
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)  
PARAMETER  
Drain-Source Voltage  
Gate-Source Voltage  
SYMBOL  
VDS  
LIMIT  
60  
20  
UNIT  
V
VGS  
T
C = 25 °C  
17  
12  
68  
Continuous Drain Current  
VGS at 10 V  
ID  
A
TC = 100 °C  
Pulsed Drain Currenta, e  
IDM  
Linear Derating Factor  
0.40  
100  
60  
3.7  
W/°C  
mJ  
Single Pulse Avalanche Energyb, e  
EAS  
PD  
T
C = 25 °C  
Maximum Power Dissipation  
W
V/ns  
°C  
TA = 25 °C  
Peak Diode Recovery dV/dtc, e  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)  
dV/dt  
TJ, Tstg  
4.5  
- 55 to + 175  
300d  
for 10 s  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).  
b. VDD = 25 V, starting TJ = 25 °C, L = 400 μH, Rg = 25 , IAS = 17 A (see fig. 12).  
c. ISD 17 A, dI/dt 140 A/μs, VDD VDS, TJ 175 °C.  
d. 1.6 mm from case.  
e. Uses IRFZ24, SiHFZ24 data and test conditions.  
* Pb containing terminations are not RoHS compliant, exemptions may apply  
Document Number: 90366  
S11-1063-Rev. C, 30-May-11  
www.vishay.com  
1
This document is subject to change without notice.  
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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