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SIGC57T120R3 PDF预览

SIGC57T120R3

更新时间: 2024-11-18 03:03:23
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率控制双极性晶体管
页数 文件大小 规格书
4页 84K
描述
IGBT3 Chip

SIGC57T120R3 技术参数

是否Rohs认证: 不符合生命周期:Active
零件包装代码:DIE包装说明:UNCASED CHIP, R-XUUC-N
Reach Compliance Code:compliantECCN代码:EAR99
风险等级:5.63Is Samacsys:N
最大集电极电流 (IC):50 A集电极-发射极最大电压:1200 V
配置:SINGLE门极发射器阈值电压最大值:6.5 V
门极-发射极最大电压:20 VJESD-30 代码:R-XUUC-N
JESD-609代码:e0元件数量:1
最高工作温度:150 °C封装主体材料:UNSPECIFIED
封装形状:RECTANGULAR封装形式:UNCASED CHIP
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
认证状态:Not Qualified子类别:Insulated Gate BIP Transistors
表面贴装:YES端子面层:TIN LEAD
端子形式:NO LEAD端子位置:UPPER
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:POWER CONTROL
晶体管元件材料:SILICON标称断开时间 (toff):610 ns
标称接通时间 (ton):135 nsBase Number Matches:1

SIGC57T120R3 数据手册

 浏览型号SIGC57T120R3的Datasheet PDF文件第2页浏览型号SIGC57T120R3的Datasheet PDF文件第3页浏览型号SIGC57T120R3的Datasheet PDF文件第4页 
SIGC57T120R3  
IGBT3 Chip  
FEATURES:  
This chip is used for:  
· power module  
C
·
·
·
·
·
1200V Trench + Field Stop technology  
low turn-off losses  
short tail current  
positive temperature coefficient  
easy paralleling  
Applications:  
drives  
G
·
E
Chip Type  
VCE  
ICn  
Die Size  
7.6 x 7.53 mm2  
Package  
Ordering Code  
Q67050-  
A4106-A001  
SIGC57T120R3  
1200V 50A  
sawn on foil  
MECHANICAL PARAMETER:  
mm  
Raster size  
7.6 x 7.53  
4x(2.98 x 2.97)  
1.139 x 1.139  
57.2 / 42.8  
140  
Emitter pad size  
Gate pad size  
Area total / active  
Thickness  
mm2  
µm  
Wafer size  
150  
mm  
grd  
Flat position  
90  
Max.possible chips per wafer  
Passivation frontside  
Emitter metallization  
246 pcs  
Photoimide  
3200 nm AlSiCu  
1400 nm Ni Ag –system  
suitable for epoxy and soft solder die bonding  
Collector metallization  
Die bond  
electrically conductive glue or solder  
Wire bond  
Al, <500µm  
Reject Ink Dot Size  
Æ 0.65mm ; max 1.2mm  
store in original container, in dry nitrogen,  
< 6 month at an ambient temperature of 23°C  
Recommended Storage Environment  
Edited by INFINEON Technologies AI PS DD HV3, L7661A, Edition 2, 04.09.2003  

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