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SIGC57T120R3L PDF预览

SIGC57T120R3L

更新时间: 2024-11-21 03:03:23
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率控制双极性晶体管
页数 文件大小 规格书
4页 71K
描述
IGBT3 Chip

SIGC57T120R3L 技术参数

生命周期:Active零件包装代码:DIE
包装说明:UNCASED CHIP, R-XUUC-N6针数:6
Reach Compliance Code:compliant风险等级:5.57
Is Samacsys:N最大集电极电流 (IC):50 A
集电极-发射极最大电压:1200 V配置:SINGLE
门极发射器阈值电压最大值:6.5 V门极-发射极最大电压:20 V
JESD-30 代码:R-XUUC-N6JESD-609代码:e3
元件数量:1端子数量:6
最高工作温度:150 °C封装主体材料:UNSPECIFIED
封装形状:RECTANGULAR封装形式:UNCASED CHIP
极性/信道类型:N-CHANNEL认证状态:Not Qualified
子类别:Insulated Gate BIP Transistors表面贴装:YES
端子面层:MATTE TIN端子形式:NO LEAD
端子位置:UPPER晶体管应用:POWER CONTROL
晶体管元件材料:SILICON标称断开时间 (toff):610 ns
标称接通时间 (ton):140 nsBase Number Matches:1

SIGC57T120R3L 数据手册

 浏览型号SIGC57T120R3L的Datasheet PDF文件第2页浏览型号SIGC57T120R3L的Datasheet PDF文件第3页浏览型号SIGC57T120R3L的Datasheet PDF文件第4页 
SIGC57T120R3L  
IGBT3 Chip  
FEATURES:  
This chip is used for:  
· power module  
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·
·
·
·
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1200V Trench + Field Stop technology  
120µm chip  
low turn-off losses  
short tail current  
positive temperature coefficient  
easy paralleling  
C
E
Applications:  
drives  
G
·
Chip Type  
VCE  
ICn  
Die Size  
7.6 x 7.53 mm2  
Package  
Ordering Code  
Q67050-  
A4267-A101  
SIGC57T120R3L 1200V 50A  
sawn on foil  
MECHANICAL PARAMETER:  
mm  
Raster size  
7.6 x 7.53  
6.08 x 6.05  
1.14 x 1.14  
57.2 / 42.8  
120  
Emitter pad size ( include gate pad )  
Gate pad size  
Area total / active  
mm2  
µm  
Thickness  
Wafer size  
150  
mm  
grd  
Flat position  
90  
Max.possible chips per wafer  
Passivation frontside  
Emitter metallization  
246 pcs  
Photoimide  
3200 nm AlSiCu  
1400 nm Ni Ag –system  
suitable for epoxy and soft solder die bonding  
Collector metallization  
Die bond  
electrically conductive glue or solder  
Wire bond  
Al, <500µm  
Reject Ink Dot Size  
Æ 0.65mm ; max 1.2mm  
store in original container, in dry nitrogen,  
< 6 month at an ambient temperature of 23°C  
Recommended Storage Environment  
Edited by INFINEON Technologies AI PS DD HV3, L7661B, Edition 2, 04.09.03  

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