Datasheet > Si7111EDN

Si7111EDN

更新时间： 2024-09-18 14:55:59

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
9页	205K
描述
P-Channel 30 V (D-S) MOSFET

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Si7111EDN 数据手册

Si7111EDN

Vishay Siliconix

www.vishay.com

P-Channel 30 V (D-S) MOSFET

FEATURES

• TrenchFET^®Gen III p-channel power MOSFET

PowerPAK^®1212-8 Single

• R_DS(on)rating at V_GS= -2.5 V

• 100 % R_gand UIS tested

• Typical ESD protection: 4600 V HBM

• Material categorization: for definitions of

compliance please see www.vishay.com/doc?99912

APPLICATIONS

• Battery switch

Top View

Bottom View

• Adapter and charger switch

PRODUCT SUMMARY

V_DS(V)

R_DS(on)max. () at V_GS= -4.5 V

• Load switch

-30

• Battery management in mobile

devices

0.00855

0.01600

30.5

R_DS(on)max. () at V_GS= -2.5 V

Q_gtyp. (nC)

I_D(A)

60 ^{a, g}

P-Channel MOSFET

Configuration

Single

ORDERING INFORMATION

Package

Lead (Pb)-free and halogen-free

PowerPAK 1212-8

Si7111EDN-T1-GE3

ABSOLUTE MAXIMUM RATINGS (T_A= 25 °C, unless otherwise noted)

PARAMETER

SYMBOL

LIMIT

-30

60 ^a

UNIT

Drain-source voltage

Gate-source voltage

V_DS

V_GS

T_C= 25 °C

T_C= 70 °C

T_A= 25 °C

T_A= 70 °C

49.3

Continuous drain current (T_J= 150 °C)

I_D

17.4 ^{a, b}

13.9 ^{a, b}

150

Pulsed drain current (t = 100 μs)

I_DM

I_S

T_C= 25 °C

T_A= 25 °C

47.3

3.7 ^{a, b}

Continuous source-drain diode current

Single pulse avalanche current

Single pulse avalanche energy

I_AS

E_AS

33.3

L = 0.1 mH

T_C= 25 °C

T_C= 70 °C

T_A= 25 °C

T_A= 70 °C

Maximum power dissipation

P_D

4.1 ^{a, b}

2.6 ^{a, b}

-55 to +150

260

Operating junction and storage temperature range

Soldering recommendations (peak temperature) ^c

T_J, T_stg

°C

THERMAL RESISTANCE RATINGS

PARAMETER

Maximum junction-to-ambient ^a

SYMBOL

R_thJA

R_thJF

TYPICAL

MAXIMUM

UNIT

t  xx s

Steady state

2.4

°C/W

Maximum junction-to-case (drain)

1.9

Notes

a. Package limited.

b. Surface mounted on 1" x 1" FR4 board.

c. t = 10 s.

d. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed

copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed

and is not required to ensure adequate bottom side solder interconnection.

e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.

f. Maximum under steady state conditions is 81 °C/W.

g. T_C= 25 °C.

S16-1520-Rev. A, 01-Aug-16

Document Number: 67807

For technical questions, contact: pmostechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

12 3 4 5 6 7...9

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