Si7116BDN
Vishay Siliconix
www.vishay.com
N-Channel 40 V (D-S) MOSFET
FEATURES
• TrenchFET® Gen IV power MOSFET
PowerPAK® 1212-8PT
D
8
D
7
D
D
5
6
• Very low Qg and Qoss reduce power loss and
improve efficiency
• Optimized Qg, Qgd, and Qgd/Qgs ratio reduces
switching related power loss
• 100 % Rg and UIS tested
3.3 mm
0.75 mm
1
S
2
S
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
3
S
4
G
m
mm
3.3
D
Top View
Bottom View
APPLICATIONS
• Synchronous rectification
• Synchronous buck converter
• High power density DC/DC
PRODUCT SUMMARY
VDS (V)
40
RDS(on) max. () at VGS = 10 V
0.0074
0.0096
14.2
G
RDS(on) max. () at VGS = 4.5 V
Qg typ. (nC)
• Load switching
N-Channel MOSFET
S
I
D (A)
65
Configuration
Single
ORDERING INFORMATION
Package
Lead (Pb)-free and halogen-free
PowerPAK 1212-8PT
Si7116BDN-T1-GE3
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
40
UNIT
Drain-source voltage
Gate-source voltage
VDS
V
VGS
20
T
C = 25 °C
C = 70 °C
65
T
52
Continuous drain current (TJ = 150 °C)
ID
TA = 25 °C
TA = 70 °C
18.4 b, c
14.7 b, c
100
A
Pulsed drain current (t = 100 μs)
IDM
IS
TC = 25 °C
TA = 25 °C
57
4.5 b, c
Continuous source-drain diode current
Single pulse avalanche current
Single pulse avalanche energy
IAS
30
L = 0.1 mH
EAS
45
mJ
W
T
C = 25 °C
C = 70 °C
62.5
T
40
Maximum power dissipation
PD
TA = 25 °C
TA = 70 °C
5 b, c
3.2 b, c
-55 to +150
260
Operating junction and storage temperature range
Soldering recommendations (peak temperature) c
TJ, Tstg
°C
THERMAL RESISTANCE RATINGS
PARAMETER
Maximum junction-to-ambient b
SYMBOL
RthJA
TYPICAL
20
MAXIMUM
UNIT
t 10 s
Steady state
25
°C/W
Maximum junction-to-case (drain)
RthJC
1.4
2.0
Notes
a. TC = 25 °C
b. Surface mounted on 1" x 1" FR4 board
c. t = 10 s
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8S is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components
f. Maximum under steady state conditions is 60 °C/W
S20-0809-Rev. A, 19-Oct-2020
Document Number: 78973
1
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000