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Si7116BDN PDF预览

Si7116BDN

更新时间: 2024-09-18 14:55:39
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威世 - VISHAY /
页数 文件大小 规格书
7页 198K
描述
N-Channel 40 V (D-S) MOSFET

Si7116BDN 数据手册

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Si7116BDN  
Vishay Siliconix  
www.vishay.com  
N-Channel 40 V (D-S) MOSFET  
FEATURES  
• TrenchFET® Gen IV power MOSFET  
PowerPAK® 1212-8PT  
D
8
D
7
D
D
5
6
• Very low Qg and Qoss reduce power loss and  
improve efficiency  
• Optimized Qg, Qgd, and Qgd/Qgs ratio reduces  
switching related power loss  
• 100 % Rg and UIS tested  
3.3 mm  
0.75 mm  
1
S
2
S
• Material categorization: for definitions of compliance  
please see www.vishay.com/doc?99912  
3
S
4
G
m
mm  
1
3.3  
D
Top View  
Bottom View  
APPLICATIONS  
• Synchronous rectification  
• Synchronous buck converter  
• High power density DC/DC  
PRODUCT SUMMARY  
VDS (V)  
40  
RDS(on) max. () at VGS = 10 V  
0.0074  
0.0096  
14.2  
G
RDS(on) max. () at VGS = 4.5 V  
Qg typ. (nC)  
• Load switching  
N-Channel MOSFET  
S
I
D (A)  
65  
Configuration  
Single  
ORDERING INFORMATION  
Package  
Lead (Pb)-free and halogen-free  
PowerPAK 1212-8PT  
Si7116BDN-T1-GE3  
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
LIMIT  
40  
UNIT  
Drain-source voltage  
Gate-source voltage  
VDS  
V
VGS  
20  
T
C = 25 °C  
C = 70 °C  
65  
T
52  
Continuous drain current (TJ = 150 °C)  
ID  
TA = 25 °C  
TA = 70 °C  
18.4 b, c  
14.7 b, c  
100  
A
Pulsed drain current (t = 100 μs)  
IDM  
IS  
TC = 25 °C  
TA = 25 °C  
57  
4.5 b, c  
Continuous source-drain diode current  
Single pulse avalanche current  
Single pulse avalanche energy  
IAS  
30  
L = 0.1 mH  
EAS  
45  
mJ  
W
T
C = 25 °C  
C = 70 °C  
62.5  
T
40  
Maximum power dissipation  
PD  
TA = 25 °C  
TA = 70 °C  
5 b, c  
3.2 b, c  
-55 to +150  
260  
Operating junction and storage temperature range  
Soldering recommendations (peak temperature) c  
TJ, Tstg  
°C  
THERMAL RESISTANCE RATINGS  
PARAMETER  
Maximum junction-to-ambient b  
SYMBOL  
RthJA  
TYPICAL  
20  
MAXIMUM  
UNIT  
t 10 s  
Steady state  
25  
°C/W  
Maximum junction-to-case (drain)  
RthJC  
1.4  
2.0  
Notes  
a. TC = 25 °C  
b. Surface mounted on 1" x 1" FR4 board  
c. t = 10 s  
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8S is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed  
and is not required to ensure adequate bottom side solder interconnection  
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components  
f. Maximum under steady state conditions is 60 °C/W  
S20-0809-Rev. A, 19-Oct-2020  
Document Number: 78973  
1
For technical questions, contact: pmostechsupport@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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