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SI7120ADN PDF预览

SI7120ADN

更新时间: 2024-11-07 09:25:55
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
12页 578K
描述
N-Channel 60 V (D-S) MOSFET

SI7120ADN 数据手册

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New Product  
Si7120ADN  
Vishay Siliconix  
N-Channel 60 V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
Halogen-free According to IEC 61249-2-21  
VDS (V)  
RDS(on) (Ω)  
ID (A)  
9.5  
Definition  
0.021 at VGS = 10 V  
0.031 at VGS = 4.5 V  
TrenchFET® Power MOSFET  
100 % Rg Tested  
100 % UIS Tested  
60  
7.9  
Compliant to RoHS Directive 2002/95/EC  
PowerPAK® 1212-8  
APPLICATIONS  
Primary Side Switch  
Synchronous Rectification  
S
3.30 mm  
3.30 mm  
D
1
S
2
S
3
G
4
D
8
D
G
7
D
6
D
5
Bottom View  
Ordering Information: Si7120ADN-T1-GE3 (Lead (Pb)-free and Halogen-free)  
S
N-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Symbol  
10 s  
Steady State  
Unit  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
60  
20  
V
VGS  
TA = 25 °C  
TA = 70 °C  
9.5  
7.6  
6.0  
Continuous Drain Current (TJ = 150 °C)  
ID  
4.8  
Pulsed Drain Current  
Continuous Source Current (Diode Conduction)a  
IDM  
IS  
40  
A
3.2  
1.3  
Single Avalanche Current  
IAS  
EAS  
22  
24  
L = 0.1 mH  
Single Avalanche Energy  
mJ  
W
TA = 25 °C  
TA = 70 °C  
3.8  
1.5  
1.0  
Maximum Power Dissipationa  
PD  
2.4  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)b, c  
TJ, Tstg  
- 55 to 150  
260  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
RthJA  
RthJC  
Typical  
Maximum  
Unit  
t 10 s  
Steady State  
Steady State  
26  
65  
33  
81  
Maximum Junction-to-Ambienta  
°C/W  
Maximum Junction-to-Case (Drain)  
1.9  
2.4  
Notes:  
a. Surface mounted on 1" x 1" FR4 board.  
b. See solder profile (www.vishay.com/ppg?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and  
is not required to ensure adequate bottom side solder interconnection.  
c. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.  
Document Number: 72959  
S10-1041-Rev. A, 03-May-10  
www.vishay.com  
1

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