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SI7108DN PDF预览

SI7108DN

更新时间: 2024-09-17 06:11:35
品牌 Logo 应用领域
威世 - VISHAY 开关
页数 文件大小 规格书
6页 107K
描述
N-Channel 20-V (D-S) Fast Switching MOSFET

SI7108DN 数据手册

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Si7108DN  
Vishay Siliconix  
N-Channel 20-V (D-S) Fast Switching MOSFET  
FEATURES  
PRODUCT SUMMARY  
D TrenchFETr Gen II Power MOSFET for  
VDS (V)  
rDS(on) ( )  
ID (A)  
Qg (Typ)  
Ultra Low On-Resistance  
RoHS  
COMPLIANT  
0.0049 @ V = 10 V  
GS  
22  
D New Low Thermal Resistance PowerPAKr  
Package with Low 1.07-mm Profile  
D 100% Rg Tested  
20  
20  
0.0061 @ V = 4.5 V  
19.7  
GS  
APPLICATIONS  
PowerPAK 1212-8  
D Synchronous Rectification  
D Point-of-Load Converters  
D Protection Devices  
D Hot Swap  
S
3.30 mm  
3.30 mm  
1
D
S
2
S
3
G
4
D
8
D
7
G
D
6
D
5
Bottom View  
Ordering Information: Si7108DN-T1—E3 (Lead (Pb)-Free)  
S
N-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS (T = 25_C UNLESS OTHERWISE NOTED)  
A
Parameter  
Symbol  
10 secs  
Steady State  
Unit  
Drain-Source Voltage  
Gate-Source Voltage  
V
20  
DS  
V
V
GS  
"16  
T
= 25_C  
= 70_C  
22  
14  
A
a
Continuous Drain Current (T = 150_C)  
I
J
D
T
A
17.6  
11.2  
A
Pulsed Drain Current  
I
60  
DM  
a
Continuous Source Current (Diode Conduction)  
I
S
3.2  
1.3  
Single Avalanche Current  
I
22  
24  
A
AS  
L = 0.1 mH  
Single Avalanche Energy  
E
mJ  
AS  
T
= 25_C  
= 70_C  
3.8  
2.0  
1.5  
0.8  
A
a
Maximum Power Dissipation  
P
W
D
T
A
Operating Junction and Storage Temperature Range  
T , T  
J
–55 to 150  
260  
stg  
_C  
b, c  
Soldering Recommendations (Peak Temperature)  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
Typical  
Maximum  
Unit  
t v 10 sec  
Steady State  
Steady State  
24  
65  
33  
81  
a
Maximum Junction-to-Ambient  
R
R
thJA  
_C/W  
Maximum Junction-to-Case (Drain)  
1.9  
2.4  
thJC  
Notes  
a. Surface Mounted on 1” x 1” FR4 Board.  
b. See Reliability Manual for profile. The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the  
singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder  
interconnection.  
c. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.  
Document Number: 73216  
S-51413—Rev. C, 01-Aug-05  
www.vishay.com  
1

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