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SGR20N40L PDF预览

SGR20N40L

更新时间: 2024-11-07 22:21:55
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD /
页数 文件大小 规格书
5页 152K
描述
High input impedance

SGR20N40L 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:TO-252包装说明:DPAK-3
针数:3Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.71
其他特性:LOW CONDUCTION LOSS外壳连接:COLLECTOR
集电极-发射极最大电压:400 V配置:SINGLE
门极发射器阈值电压最大值:1.4 V门极-发射极最大电压:6 V
JEDEC-95代码:TO-252JESD-30 代码:R-PSSO-G2
JESD-609代码:e0元件数量:1
端子数量:2最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):45 W认证状态:Not Qualified
子类别:Insulated Gate BIP Transistors表面贴装:YES
端子面层:Tin/Lead (Sn/Pb)端子形式:GULL WING
端子位置:SINGLE晶体管应用:GENERAL PURPOSE SWITCHING
晶体管元件材料:SILICON标称断开时间 (toff):1800 ns
标称接通时间 (ton):1900 nsBase Number Matches:1

SGR20N40L 数据手册

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August 2001  
IGBT  
SGR20N40L / SGU20N40L  
General Description  
Features  
Insulated Gate Bipolar Transistors (IGBTs) with a trench  
gate structure provide superior conduction and switching  
performance in comparison with transistors having a planar  
gate structure. They also have wide noise immunity. These  
devices are very suitable for strobe applications  
High input impedance  
High peak current capability (150A)  
Easy gate drive  
Surface Mount : SGR20N40L  
Straight Lead : SGU20N40L  
Application  
Strobe flash.  
C
C
G
D-PAK  
E
G
I-PAK  
G C E  
E
Absolute Maximum Ratings  
T = 25°C unless otherwise noted  
C
Symbol  
Description  
SGR / SGU20N40L  
Units  
V
V
V
Collector - Emitter Voltage  
400  
± 6  
CES  
GES  
Gate - Emitter Voltage  
V
I
Pulsed Collector Current  
150  
A
CM (1)  
P
M a x i m u m P o w e r D i s s i p a t i o n  
Operating Junction Temperature  
Storage Temperature Range  
Maximum Lead Temp. for soldering  
purposes, 1/8” from case for 5 seconds  
@ T = 25°C  
45  
W
C
C
T
-40 to +150  
-40 to +150  
°C  
°C  
J
T
stg  
T
300  
°C  
L
Notes :  
(1) Repetitive rating : Pulse width limited by max. junction temperature  
Thermal Characteristics  
Symbol  
Parameter  
Typ.  
--  
Max.  
Units  
°C/W  
°C/W  
°C/W  
R
R
R
Thermal Resistance, Junction-to-Case  
3.0  
50  
θJC  
(D-PAK)  
(I-PAK)  
Thermal Resistance, Junction-to-Ambient (PCB Mount)  
Thermal Resistance, Junction-to-Ambient  
--  
θJA  
θJA  
(2)  
--  
110  
Notes :  
(2) Mounted on 1” square PCB (FR4 or G-10 Material)  
©2001 Fairchild Semiconductor Corporation  
SGR20N40L / SGU20N40L Rev. A1  

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