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S2076TBC PDF预览

S2076TBC

更新时间: 2024-11-24 15:50:15
品牌 Logo 应用领域
AMCC 电信电信集成电路
页数 文件大小 规格书
28页 952K
描述
Telecom Circuit, 1-Func, Bipolar, PBGA208, 23 X 23 MM, TBGA-208

S2076TBC 技术参数

是否Rohs认证:不符合生命周期:Obsolete
零件包装代码:BGA包装说明:LBGA, BGA208,17X17,50
针数:208Reach Compliance Code:unknown
HTS代码:8542.39.00.01风险等级:5.78
Is Samacsys:NJESD-30 代码:S-PBGA-B208
JESD-609代码:e0长度:23 mm
功能数量:1端子数量:208
最高工作温度:70 °C最低工作温度:
封装主体材料:PLASTIC/EPOXY封装代码:LBGA
封装等效代码:BGA208,17X17,50封装形状:SQUARE
封装形式:GRID ARRAY, LOW PROFILE峰值回流温度(摄氏度):NOT SPECIFIED
电源:3.3 V认证状态:Not Qualified
座面最大高度:1.65 mm子类别:Other Telecom ICs
最大压摆率:910 mA标称供电电压:3.3 V
表面贴装:YES技术:BIPOLAR
电信集成电路类型:TELECOM CIRCUIT温度等级:COMMERCIAL
端子面层:Tin/Lead (Sn/Pb)端子形式:BALL
端子节距:1.27 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:23 mm
Base Number Matches:1

S2076TBC 数据手册

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