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PSMN4R2-30MLD PDF预览

PSMN4R2-30MLD

更新时间: 2024-11-10 11:13:19
品牌 Logo 应用领域
安世 - NEXPERIA 开关脉冲晶体管
页数 文件大小 规格书
13页 717K
描述
N-channel 30 V, 4.2 mΩ logic level MOSFET in LFPAK33 using NextPowerS3 TechnologyProduction

PSMN4R2-30MLD 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:SMALL OUTLINE, R-PSSO-G4Reach Compliance Code:not_compliant
ECCN代码:EAR99风险等级:5.34
雪崩能效等级(Eas):59 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:30 V
最大漏极电流 (ID):70 A最大漏源导通电阻:0.0057 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PSSO-G4
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:4
工作模式:ENHANCEMENT MODE封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性/信道类型:N-CHANNEL
最大脉冲漏极电流 (IDM):366 A参考标准:IEC-60134
表面贴装:YES端子面层:Tin (Sn)
端子形式:GULL WING端子位置:SINGLE
处于峰值回流温度下的最长时间:30晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

PSMN4R2-30MLD 数据手册

 浏览型号PSMN4R2-30MLD的Datasheet PDF文件第2页浏览型号PSMN4R2-30MLD的Datasheet PDF文件第3页浏览型号PSMN4R2-30MLD的Datasheet PDF文件第4页浏览型号PSMN4R2-30MLD的Datasheet PDF文件第5页浏览型号PSMN4R2-30MLD的Datasheet PDF文件第6页浏览型号PSMN4R2-30MLD的Datasheet PDF文件第7页 
PSMN4R2-30MLD  
N-channel 30 V, 4.2 mΩ logic level MOSFET in LFPAK33  
using NextPowerS3 Technology  
11 August 2015  
Product data sheet  
1. General description  
Logic level gate drive N-channel enhancement mode MOSFET in LFPAK33 package.  
NextPowerS3 portfolio utilising Nexperia’s unique “SchottkyPlus” technology delivers  
high efficiency, low spiking performance usually associated with MOSFETs with an  
integrated Schottky or Schottky-like diode but without problematic high leakage current.  
NextPowerS3 is particularly suited to high efficiency applications at high switching  
frequencies.  
2. Features and benefits  
Ultra low QG, QGD and QOSS for high system efficiency, especially at higher switching  
frequencies  
Superfast switching with soft-recovery; s-factor > 1  
Low spiking and ringing for low EMI designs  
Unique “SchottkyPlus” technology; Schottky-like performance with < 1 µA leakage at  
25 °C  
Optimised for 4.5 V gate drive  
Low parasitic inductance and resistance  
High reliability clip bonded and solder die attach Mini Power SO8 package; no glue,  
no wire bonds, qualified to 175 °C  
Exposed leads for optimal visual solder inspection  
3. Applications  
On-board DC-to-DC solutions for server and telecommunications  
Secondary-side synchronous rectification in telecommunication applications  
Voltage regulator modules (VRM)  
Point-of-Load (POL) modules  
Power delivery for V-core, ASIC, DDR, GPU, VGA and system components  
Brushed and brushless motor control  
4. Quick reference data  
Table 1.  
Symbol  
Quick reference data  
Parameter  
Conditions  
Min  
Typ  
Max  
30  
Unit  
V
VDS  
ID  
drain-source voltage  
drain current  
25 °C ≤ Tj ≤ 175 °C  
Tmb = 25 °C; VGS = 10 V; Fig. 2  
-
-
-
-
-
-
[1]  
70  
A
Ptot  
total power dissipation Tmb = 25 °C; Fig. 1  
65  
W
 
 
 
 

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