是否Rohs认证: | 符合 | 生命周期: | Active |
零件包装代码: | CSP | 包装说明: | VFBGA, BGA9,3X3,16 |
针数: | 9 | Reach Compliance Code: | compliant |
风险等级: | 1.7 | 内置保护: | OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE |
驱动器位数: | 1 | JESD-30 代码: | S-PBGA-B9 |
长度: | 1.36 mm | 湿度敏感等级: | 1 |
端子数量: | 9 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 最大输出电流: | 0.015 A |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | VFBGA |
封装等效代码: | BGA9,3X3,16 | 封装形状: | SQUARE |
封装形式: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 电源: | 5 V |
认证状态: | Not Qualified | 筛选级别: | IEC-60134 |
座面最大高度: | 0.55 mm | 子类别: | Peripheral Drivers |
最大供电电压: | 5.5 V | 最小供电电压: | 4 V |
标称供电电压: | 5 V | 表面贴装: | YES |
温度等级: | INDUSTRIAL | 端子形式: | BALL |
端子节距: | 0.4 mm | 端子位置: | BOTTOM |
宽度: | 1.36 mm | Base Number Matches: | 1 |
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