NEW
I/O Card Interface Connectors
NX Series
3. ESD Secure
Thermoplastic molded covers assures insulation
of the connections and shields from ESD.
4. Secure Latching
A built-in latch assures correct and secure
mating of connector.
5. Reliable Conductor Termination
Reliable termination of conductors is
accomplished by proven IDC termination.
6. Sequential Mating
The 0.8mm pitch contacts are engaging the
corresponding parts in sequence: Ground-
Power & Signal
7. Rugged Construction
Securely attached to the board with optional
screws.
■Features
1. Low Profile
8. Card Frame Kits
Protorusion above the PCB board is only 2.9mm, and the
connectors can be mounted to type I and II I/O cards.
Available as a separate part number.
9. Secure Attachment to Frame Kit.
Compliant mounting bracket attaches the
connectore directly to the frame kit.
2. EMI/RFI protection
Full metal shielding. Shield connects first, ahead of
contacts.
■Applications
Used with I/O cards, portable personal computers,and the external connections of various small-sized portable
terminals.
■Specifications
Current
0.5 A
Operating temperature
Operating humidity
-30ç to +70ç (Note 1) Storage temperature range -10ç to +60ç (Note 2)
Ratings
95% R.H. or less
(No condensation)
Voltage
125 V AC
Storage humidity range
40 to 70% (Note 2)
Item
Requirements
Conditions
1. Insulation resistance
2. Voltage proof
Measured at 100 V DC
250 Mø or greater
300 V AC for 1 minute
Measured at 100 mA
No flashover or breakdown
3. Contact resistance
40 mø or less (initial value) (Note 3)
No electrical discontinuity for 10µs or
greater
Frequency of 10 to 55 Hz, amplitude of 0.75 mm,
3 directions, 2 hours each
4. Vibration
Temperature of 40ç 2ç, humidity of 90 to 95%,
duration 96h
5. Humidity resistance
Insulation resistance: 250 Mø or greater
6. Rapid change
of temperature
No damage, cracks, or defects at any
part
-55ç, 30 min./15 to 30ç, within 5 min/85ç, 30 min
/15 to 35ç, within 5 min, for 5 cycles
7. Insertion and
withdrawal life
Change of contact resistance from the
start should be 60 mø or less
3,000 times
Reflow: at the recommended temperature profile
8. Resistance to
soldering heat
No melting of resin portions which affect
performance
Soldering iron temperature: 300ç for 3 seconds
Note 1 : Includes temperature rise when conducting.
Note 2 : The term storage refers to an unused products prior to boards mounting (including packing materials) that is being kept for
a long period.
The operating temperature and humidity range are applied to the non-conducting condition following board assembly.
Note 3 : The aforementioned specifications are representative of this series. For information on specific parts, confirm with Sales Office.
B8