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NX60T-9SAA-SH(51) PDF预览

NX60T-9SAA-SH(51)

更新时间: 2024-11-06 21:13:27
品牌 Logo 应用领域
广濑 - HRS 连接器
页数 文件大小 规格书
16页 606K
描述
Telecom and Datacom Connector

NX60T-9SAA-SH(51) 技术参数

是否Rohs认证: 符合生命周期:Active
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8536.69.40.30风险等级:5.69
连接器类型:TELECOM AND DATACOM CONNECTORBase Number Matches:1

NX60T-9SAA-SH(51) 数据手册

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NEW  
I/O Card Interface Connectors  
NX Series  
3. ESD Secure  
Thermoplastic molded covers assures insulation  
of the connections and shields from ESD.  
4. Secure Latching  
A built-in latch assures correct and secure  
mating of connector.  
5. Reliable Conductor Termination  
Reliable termination of conductors is  
accomplished by proven IDC termination.  
6. Sequential Mating  
The 0.8mm pitch contacts are engaging the  
corresponding parts in sequence: Ground-  
Power & Signal  
7. Rugged Construction  
Securely attached to the board with optional  
screws.  
Features  
1. Low Profile  
8. Card Frame Kits  
Protorusion above the PCB board is only 2.9mm, and the  
connectors can be mounted to type I and II I/O cards.  
Available as a separate part number.  
9. Secure Attachment to Frame Kit.  
Compliant mounting bracket attaches the  
connectore directly to the frame kit.  
2. EMI/RFI protection  
Full metal shielding. Shield connects first, ahead of  
contacts.  
Applications  
Used with I/O cards, portable personal computers,and the external connections of various small-sized portable  
terminals.  
Specifications  
Current  
0.5 A  
Operating temperature  
Operating humidity  
-30ç to +70ç (Note 1) Storage temperature range -10ç to +60ç (Note 2)  
Ratings  
95% R.H. or less  
(No condensation)  
Voltage  
125 V AC  
Storage humidity range  
40 to 70% (Note 2)  
Item  
Requirements  
Conditions  
1. Insulation resistance  
2. Voltage proof  
Measured at 100 V DC  
250 Mø or greater  
300 V AC for 1 minute  
Measured at 100 mA  
No flashover or breakdown  
3. Contact resistance  
40 mø or less (initial value) (Note 3)  
No electrical discontinuity for 10µs or  
greater  
Frequency of 10 to 55 Hz, amplitude of 0.75 mm,  
3 directions, 2 hours each  
4. Vibration  
Temperature of 40ç 2ç, humidity of 90 to 95%,  
duration 96h  
5. Humidity resistance  
Insulation resistance: 250 Mø or greater  
6. Rapid change  
of temperature  
No damage, cracks, or defects at any  
part  
-55ç, 30 min./15 to 30ç, within 5 min/85ç, 30 min  
/15 to 35ç, within 5 min, for 5 cycles  
7. Insertion and  
withdrawal life  
Change of contact resistance from the  
start should be 60 mø or less  
3,000 times  
Reflow: at the recommended temperature profile  
8. Resistance to  
soldering heat  
No melting of resin portions which affect  
performance  
Soldering iron temperature: 300ç for 3 seconds  
Note 1 : Includes temperature rise when conducting.  
Note 2 : The term storage refers to an unused products prior to boards mounting (including packing materials) that is being kept for  
a long period.  
The operating temperature and humidity range are applied to the non-conducting condition following board assembly.  
Note 3 : The aforementioned specifications are representative of this series. For information on specific parts, confirm with Sales Office.  
B8  

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