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NVJS3151P PDF预览

NVJS3151P

更新时间: 2024-11-10 01:16:15
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
5页 73K
描述
Trench Power MOSFET

NVJS3151P 数据手册

 浏览型号NVJS3151P的Datasheet PDF文件第2页浏览型号NVJS3151P的Datasheet PDF文件第3页浏览型号NVJS3151P的Datasheet PDF文件第4页浏览型号NVJS3151P的Datasheet PDF文件第5页 
NTJS3151P, NVJS3151P  
Trench Power MOSFET  
12 V, 3.3 A, Single P−Channel,  
ESD Protected SC−88  
Features  
www.onsemi.com  
Leading Trench Technology for Low R  
Extending Battery Life  
DS(ON)  
SC−88 Small Outline (2x2 mm, SC70−6 Equivalent)  
Gate Diodes for ESD Protection  
V
R
Typ  
I Max  
D
(BR)DSS  
DS(on)  
45 mW @ −4.5 V  
67 mW @ −2.5 V  
NV Prefix for Automotive and Other Applications Requiring Unique  
Site and Control Change Requirements; AEC−Q101 Qualified and  
PPAP Capable  
−12 V  
−3.3 A  
133 mW @ −1.8 V  
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS  
Compliant  
SC−88 (SOT−363)  
Applications  
D
D
1
2
3
6
D
D
S
High Side Load Switch  
Cell Phones, Computing, Digital Cameras, MP3s and PDAs  
5
4
MAXIMUM RATINGS (T = 25°C unless otherwise stated)  
J
Parameter  
Drain−to−Source Voltage  
Symbol  
Value Units  
G
V
−12  
12  
V
V
A
DSS  
Gate−to−Source Voltage  
V
GS  
Top View  
D
Continuous Drain  
Current (Note 1)  
Steady T = 25 °C  
State  
I
−2.7  
−2.0  
−3.3  
0.625  
A
D
T = 85 °C  
A
3 kW  
t 5 s  
T = 25 °C  
A
G
Power Dissipation  
(Note 1)  
Steady T = 25 °C  
State  
P
W
A
D
Pulsed Drain Current  
t = 10 ms  
p
I
−8.0  
A
DM  
Operating Junction and Storage Temperature  
T ,  
−55 to  
150  
°C  
J
S
T
STG  
MARKING DIAGRAM &  
PIN ASSIGNMENT  
Source Current (Body Diode)  
I
−0.8  
260  
A
S
Lead Temperature for Soldering Purposes  
(1/8” from case for 10 s)  
°C  
T
L
D
D
S
6
1
THERMAL RESISTANCE RATINGS (Note 1)  
XXX MG  
Parameter  
Symbol  
Max  
200  
141  
102  
Units  
SC−88/SOT−363  
CASE 419B  
STYLE 28  
G
Junction−to−Ambient – Steady State  
Junction−to−Ambient − t 5 s  
Junction−to−Lead – Steady State  
R
°C/W  
q
q
JA  
JA  
1
R
D
D
G
R
q
JL  
XXX  
M
G
= Device Code  
= Date Code  
= Pb−Free Package  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
1. Surface mounted on FR4 board using 1 in sq pad size  
(Note: Microdot may be in either location)  
(Cu area = 1.127 in sq [1 oz] including traces).  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 4 of this data sheet.  
© Semiconductor Components Industries, LLC, 2016  
1
Publication Order Number:  
June, 2016 − Rev. 4  
NTJS3151/D  
 

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