NTJS3151P, NVJS3151P
Trench Power MOSFET
12 V, 3.3 A, Single P−Channel,
ESD Protected SC−88
Features
www.onsemi.com
• Leading Trench Technology for Low R
Extending Battery Life
DS(ON)
• SC−88 Small Outline (2x2 mm, SC70−6 Equivalent)
• Gate Diodes for ESD Protection
V
R
Typ
I Max
D
(BR)DSS
DS(on)
45 mW @ −4.5 V
67 mW @ −2.5 V
• NV Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
−12 V
−3.3 A
133 mW @ −1.8 V
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
SC−88 (SOT−363)
Applications
D
D
1
2
3
6
D
D
S
• High Side Load Switch
• Cell Phones, Computing, Digital Cameras, MP3s and PDAs
5
4
MAXIMUM RATINGS (T = 25°C unless otherwise stated)
J
Parameter
Drain−to−Source Voltage
Symbol
Value Units
G
V
−12
12
V
V
A
DSS
Gate−to−Source Voltage
V
GS
Top View
D
Continuous Drain
Current (Note 1)
Steady T = 25 °C
State
I
−2.7
−2.0
−3.3
0.625
A
D
T = 85 °C
A
3 kW
t ≤ 5 s
T = 25 °C
A
G
Power Dissipation
(Note 1)
Steady T = 25 °C
State
P
W
A
D
Pulsed Drain Current
t = 10 ms
p
I
−8.0
A
DM
Operating Junction and Storage Temperature
T ,
−55 to
150
°C
J
S
T
STG
MARKING DIAGRAM &
PIN ASSIGNMENT
Source Current (Body Diode)
I
−0.8
260
A
S
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
°C
T
L
D
D
S
6
1
THERMAL RESISTANCE RATINGS (Note 1)
XXX MG
Parameter
Symbol
Max
200
141
102
Units
SC−88/SOT−363
CASE 419B
STYLE 28
G
Junction−to−Ambient – Steady State
Junction−to−Ambient − t ≤ 5 s
Junction−to−Lead – Steady State
R
°C/W
q
q
JA
JA
1
R
D
D
G
R
q
JL
XXX
M
G
= Device Code
= Date Code
= Pb−Free Package
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Surface mounted on FR4 board using 1 in sq pad size
(Note: Microdot may be in either location)
(Cu area = 1.127 in sq [1 oz] including traces).
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
© Semiconductor Components Industries, LLC, 2016
1
Publication Order Number:
June, 2016 − Rev. 4
NTJS3151/D