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NVLUD4C26N PDF预览

NVLUD4C26N

更新时间: 2024-11-20 01:18:19
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
7页 130K
描述
Power MOSFET

NVLUD4C26N 数据手册

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NVLUD4C26N  
Power MOSFET  
30 V, 7.3 A, Dual N−Channel,  
2.0x2.0x0.55 mm mCoolt UDFN6 Package  
Features  
UDFN Package with Exposed Drain Pads for Excellent Thermal  
Conduction  
www.onsemi.com  
MOSFET  
Low Profile UDFN 2.0 x 2.0 x 0.55 mm for Board Space Saving  
Ultra Low R  
DS(on)  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(on)  
AEC−Q101 Qualified and PPAP Capable  
21 mW @ 10 V  
24 mW @ 4.5 V  
26 mW @ 3.7 V  
28 mW @ 3.3 V  
36 mW @ 2.5 V  
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS  
Compliant  
30 V  
7.3 A  
Applications  
Power Load Switch  
Wireless Charging  
DC−DC Converters  
65 mW @ 1.8 V  
D1  
D2  
MAXIMUM RATINGS (T = 25°C unless otherwise stated)  
J
Parameter  
Drain-to-Source Voltage  
Gate-to-Source Voltage  
Symbol  
Value  
30  
Unit  
V
V
DSS  
G1  
G2  
V
GS  
12  
V
S1  
Dual N−Channel MOSFET  
S2  
Continuous Drain  
Current (Note 1)  
Steady  
State  
T = 25°C  
I
D
7.3  
A
A
T = 85°C  
A
5.3  
t 5 s  
T = 25°C  
9.1  
A
MARKING  
DIAGRAM  
Power Dissipa-  
tion (Note 1)  
Steady  
State  
T = 25°C  
A
P
1.70  
W
A
D
1
6
UDFN6  
CASE 517BF  
mCOOLt  
AC MG  
t 5 s  
T = 25°C  
A
2.63  
4.8  
G
Continuous Drain  
Current (Note 2)  
Steady  
State  
T = 25°C  
A
I
D
1
AC= Specific Device Code  
M = Date Code  
T = 85°C  
A
3.4  
G
= Pb−Free Package  
Power Dissipation (Note 2)  
Pulsed Drain Current  
T = 25°C  
P
0.72  
22  
W
A
A
D
(Note: Microdot may be in either location)  
t = 10 ms  
p
I
DM  
MOSFET Operating Junction and Storage  
Temperature  
T ,  
-55 to  
150  
°C  
J
T
STG  
Source Current (Body Diode) (Note 1)  
I
S
3.0  
A
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
L
260  
°C  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq  
[2 oz] including traces).  
2. Surface-mounted on FR4 board using the minimum recommended pad size,  
2 oz. Cu.  
(Top View)  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 3 of  
this data sheet.  
© Semiconductor Components Industries, LLC, 2016  
1
Publication Order Number:  
December, 2016 − Rev. 0  
NVLUD4C26N/D  
 

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