DATA SHEET
www.onsemi.com
MOSFET - Power, Single
N-Channel
60 V, 21 mW, 25 A
V
R
MAX
I MAX
D
(BR)DSS
DS(ON)
21 mW @ 10 V
29 mW @ 4.5 V
60 V
25 A
NVLJWS022N06CL
Features
ELECTRICAL CONNECTION
D
• Small Footprint for Compact Design
• Low R
to Minimize Conduction Losses
• Low Q and Capacitance to Minimize Driver Losses
DS(on)
G
G
• Wettable Flank Option for Enhanced Optical Inspection
• AEC−Q101 Qualified and PPAP Capable
• These Devices are Pb−Free and are RoHS Compliant
S
N−CHANNEL MOSFET
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
Parameter
Drain−to−Source Voltage
Symbol
Value
60
Unit
V
MARKING
DIAGRAM
V
DSS
Gate−to−Source Voltage
V
GS
20
V
XXXX
ALYW
Continuous Drain
Current R
T
= 25°C
= 100°C
= 25°C
I
25
A
C
D
WDFNW6 (2.05x2.05)
CASE 515AD
q
JC
T
C
18
(Notes 1, 3)
Steady
State
Power Dissipation
T
C
P
28
W
A
D
XXXX = Specific Device Code
R
(Note 1)
q
JC
A
L
Y
W
= Assembly Location
T
C
= 100°C
14
= Wafer Lot
= Year
Continuous Drain
Current R
T = 25°C
A
I
D
7.2
5.1
2.4
1.2
90
q
JA
= Work Week
T = 100°C
A
(Notes 1, 2, 3)
Steady
State
Power Dissipation
T = 25°C
A
P
W
D
R
(Notes 1, 2)
q
JA
T = 100°C
A
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 5 of this data sheet.
Pulsed Drain Current
T = 25°C, t = 10 ms
I
DM
A
A
p
Operating Junction and Storage Temperature
Range
T , T
−55 to
+175
°C
J
stg
Source Current (Body Diode)
I
24
42
A
S
Single Pulse Drain−to−Source Avalanche
E
AS
mJ
Energy (I
= 1.1 A)
L(pk)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T
L
260
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter
Symbol
Value
5.3
Unit
Junction−to−Case − Steady State
Junction−to−Ambient − Steady State (Note 2)
R
°C/W
q
JC
R
63
q
JA
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2
2. Surface−mounted on FR4 board using a 650 mm , 2 oz. Cu pad.
3. Maximum current for pulses as long as 1 second is higher but is dependent
on pulse duration and duty cycle.
© Semiconductor Components Industries, LLC, 2020
1
Publication Order Number:
July, 2022 − Rev. 2
NVLJWS022N06CL/D