Datasheet > NUF9001FC

NUF9001FC

更新时间： 2024-09-15 03:24:07

品牌	Logo	应用领域
安森美 - ONSEMI		/
页数	文件大小	规格书
4页	139K
描述
10 Line EMI Filter

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中文翻译

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NUF9001FC 数据手册

NUF9001FC

10 Line EMI Filter

This device is a ten−line EMI filter array for wireless applications.

Greater than −35 dB attenuation is obtained at frequencies from

800 MHz to 3.0 GHz. ESD protection is provided across all

capacitors.

http://onsemi.com

Features

• EMI Filtering and ESD Protection

• Integration of 30 Discretes

LOW−PASS FILTER

INPUT

OUTPUT

• Provides Protection for IEC61000−4−2 (Level 4)

♦ 8.0 kV (Contact)

• Flip−Chip Package

= 100 W

= 28 pF

I/O

• Moisture Sensitivity Level 1

input

• ESD Rating: Machine Model = C; Human Body Model = 3B

• Pb−Free Package is Available*

MARKING DIAGRAM

Benefits

NUF9001

AYWWG

• Reduces EMI/RFI Emissions on a Data Line

Flip−Chip

CASE 499G

• Integrated Solution Offers Cost and Space Savings

• Reduces Parasitic Inductances Which Offer a More “Ideal” Low Pass

NUF9001 = Specific Device Code

Filter Response

= Assembly Location

= Year

= Work Week

• Integrated Solution Improves System Reliability

= Pb−Free Package

Applications

(Note: Microdot may be in either location)

• EMI Filtering and ESD Protection for Data Lines

• Cell Phones

• Handheld Products

• MP3 Players

PIN CONFIGURATION

(Ball Side)

MAXIMUM RATINGS (T = 25°C unless otherwise noted)

GND

IN6

IN1

GND

IN7

IN2

GND

IN8

IN3

GND

IN9

IN4

O10

GND

IN10

IN5

Rating

Contact Discharge

Symbol

Value

Unit

ESD Discharge

IEC61000−4−2

8.0

Steady−State Power per Resistor

Steady−State Power per Package

Operating Temperature Range

Storage Temperature Range

Junction Temperature

100

200

°C

−40 to +85

−55 to +150

+125

STG

°C

ORDERING INFORMATION

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

†

Device

Package

Shipping

NUF9001FCT1

Flip−Chip 3000 Tape & Reel

NUF9001FCT1G

Flip−Chip 3000 Tape & Reel

(Pb−Free)

*For additional information on our Pb−Free strategy and soldering details, please

download the ON Semiconductor Soldering and Mounting Techniques

Reference Manual, SOLDERRM/D.

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

Publication Order Number:

March, 2006 − Rev. 5

NUF9001FC/D

12 3 4

中文翻译

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