Datasheet > NUF9002FC

NUF9002FC

更新时间： 2022-04-23 23:00:11

品牌	Logo	应用领域
安森美 - ONSEMI		/
页数	文件大小	规格书
4页	129K
描述
Low Capacitance 10 Line EMI Filter with ESD Protection

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NUF9002FC 数据手册

NUF9002FC

Low Capacitance 10 Line

EMI Filter with ESD

Protection

This device is a ten−line EMI filter array for wireless applications.

Greater than −25 dB attenuation is obtained at frequencies from

900 MHz to 3.0 GHz. ESD protection is provided across all

capacitors.

http://onsemi.com

LOW−PASS FILTER

INPUT

OUTPUT

Features

• EMI Filtering and ESD Protection

• Integration of 50 Discretes

• Provides Protection for IEC61000−4−2 (Level 4)

♦ 8.0 kV (Contact)

= 100 W

= 28 pF

I/O

input

• Flip−Chip Package

MARKING DIAGRAM

• Moisture Sensitivity Level 1

• ESD Rating: Machine Model = C; Human Body Model = 3B

• Pb−Free Package is Available*

NUF9002

AYWWG

Flip−Chip

CASE 499G

Benefits

• Reduces EMI/RFI Emissions on a Data Line

• Integrated Solution Offers Cost and Space Savings

• Reduces Parasitic Inductances Which Offer a More “Ideal” Low Pass

Filter Response

NUF9002 = Specific Device Code

= Assembly Location

= Year

= Work Week

= Pb−Free Package

• Integrated Solution Improves System Reliability

(Note: Microdot may be in either location)

PIN CONFIGURATION

Applications

(Ball Side)

• LCD for Cell Phones and PDAs

• Computers and Printers

• Communication Systems

• MP3 Players

GND

IN6

IN1

GND

IN7

IN2

GND

IN8

IN3

GND

IN9

IN4

O10

GND

IN10

IN5

MAXIMUM RATINGS (T = 25°C unless otherwise noted)

Rating

Symbol

Value

Unit

ESD Discharge

IEC61000−4−2

Contact Discharge

8.0

Steady−State Power per Resistor

Steady−State Power per Package

Operating Temperature Range

Storage Temperature Range

Junction Temperature

100

200

°C

−40 to +85

−55 to +150

+125

STG

°C

ORDERING INFORMATION

°C

†

Device

Package

Shipping

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

NUF9002FCT1

Flip−Chip 3000 Tape & Reel

NUF9002FCT1G

Flip−Chip 3000 Tape & Reel

(Pb−Free)

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

*For additional information on our Pb−Free strategy and soldering details, please

download the ON Semiconductor Soldering and Mounting Techniques

Reference Manual, SOLDERRM/D.

Publication Order Number:

March, 2006 − Rev. 1

NUF9002FC/D

12 3 4

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