NTMFS4982NF
Power MOSFET
30 V, 207 A, Single N−Channel, SO−8 FL
Features
• Integrated Schottky Diode
• Low R
to Minimize Conduction Losses
• Low Capacitance to Minimize Driver Losses
DS(on)
http://onsemi.com
• Optimized Gate Charge to Minimize Switching Losses
• These Devices are Pb−Free and are RoHS Compliant
V
R
MAX
I MAX
D
(BR)DSS
DS(ON)
Applications
• Server, Netcom, POL
1.3 mW @ 10 V
1.9 mW @ 4.5 V
30 V
207 A
• Synchronous Rectification for DC−DC Converters
• Low Side Switching
• High Performance Applications
N−CHANNEL MOSFET
(5, 6)
D
MAXIMUM RATINGS (T = 25°C unless otherwise stated)
J
Parameter
Drain−to−Source Voltage
Symbol
Value Unit
V
DSS
30
20
36
V
V
A
G
Gate−to−Source Voltage
V
GS
(4)
Continuous Drain
Current R
I
D
T = 25°C
A
q
JA
T = 85°C
A
26
(Note 1)
Power Dissipation
(Note 1)
S
(1, 2, 3)
T = 25°C
A
P
2.7
W
A
D
D
D
D
R
q
JA
MARKING
DIAGRAM
Continuous Drain
I
D
T = 25°C
A
60
43
Current R
10 sec
v
q
JA
T = 85°C
A
D
S
S
S
G
D
D
Power Dissipation
T = 25°C
A
P
I
7.4
W
A
1
4982NF
AYWZZ
R
t v 10 sec
q
JA,
Steady
State
SO−8 FLAT LEAD
CASE 488AA
STYLE 1
Continuous Drain
Current R
T = 25°C
A
26.5
19
D
q
JA
T = 85°C
A
D
(Note 2)
Power Dissipation
(Note 2)
T = 25°C
A
P
I
1.5
W
A
A
Y
= Assembly Location
= Year
= Work Week
= Lot Traceability
R
q
JA
Continuous Drain
Current R
T
C
T
C
T
C
= 25°C
= 85°C
= 25°C
207
149
89.3
D
W
ZZ
q
JC
(Note 1)
Power Dissipation
(Note 1)
P
W
R
q
JC
Pulsed Drain Current t =10ms
T = 25°C
I
350
100
A
A
ORDERING INFORMATION
p
A
DM
I
Dmaxpkg
Current limited by package
T = 25°C
A
†
Device
Package
Shipping
Operating Junction and Storage Temperature
T ,
−55 to
+150
°C
J
NTMFS4982NFT1G
SO−8FL
1500 /
T
STG
(Pb−Free)
Tape & Reel
Source Current (Body Diode)
Drain to Source dV/dt
I
S
54
6
A
NTMFS4982NFT3G
SO−8FL
5000 /
dV/dt
EAS
V/ns
mJ
(Pb−Free)
Tape & Reel
Single Pulse Drain−to−Source Avalanche
125
Energy (V = 50 V, V = 10 V, I = 50 A ,
DD
GS
L
pk
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
L = 0.1 mH, R = 25 W)
G
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
T
260
°C
L
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
*For additional information on our Pb−Free strategy
and soldering details, please download the ON
Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2014
1
Publication Order Number:
February, 2014 − Rev. 3
NTMFS4982NF/D