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NTMFS4C022N PDF预览

NTMFS4C022N

更新时间: 2024-11-25 01:11:39
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
6页 83K
描述
Power MOSFET

NTMFS4C022N 数据手册

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NTMFS4C022N  
Power MOSFET  
30 V, 2.1 mW, 136 A, Single N−Channel,  
SO−8FL  
Features  
Small Footprint (5x6 mm) for Compact Design  
www.onsemi.com  
Low R  
to Minimize Conduction Losses  
DS(on)  
Low Q and Capacitance to Minimize Driver Losses  
G
V
R
MAX  
I MAX  
D
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS  
(BR)DSS  
DS(ON)  
Compliant  
1.7 mW @ 10 V  
2.4 mW @ 4.5 V  
30 V  
136 A  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Parameter  
Drain−to−Source Voltage  
Symbol  
Value  
30  
Unit  
V
V
DSS  
D (5,6)  
Gate−to−Source Voltage  
Continuous Drain Cur-  
V
"20  
136  
V
GS  
T
T
= 25°C  
= 25°C  
I
A
C
D
rent R  
(Notes 1, 3)  
q
JC  
Steady  
State  
G (4)  
Power Dissipation R  
(Notes 1, 3)  
P
64  
30  
W
A
q
C
D
JC  
Continuous Drain Cur-  
rent R (Notes 1, 2, 3)  
T = 25°C  
A
I
S (1,2,3)  
N−CHANNEL MOSFET  
D
q
JA  
Steady  
State  
Power Dissipation R  
(Notes 1, 2, 3)  
T = 25°C  
A
P
3.1  
W
q
D
JA  
MARKING  
DIAGRAM  
Pulsed Drain Current  
T = 25°C, t = 10 ms  
I
DM  
900  
A
A
p
Operating Junction and Storage Temperature  
T , T  
55 to  
150  
°C  
J
stg  
D
S
S
S
G
D
D
1
Source Current (Body Diode)  
I
53  
A
S
4C022N  
AYWZZ  
SO−8 FLAT LEAD  
CASE 488AA  
STYLE 1  
Single Pulse Drain−to−Source Avalanche  
E
AS  
549  
mJ  
Energy (I  
= 11 A)  
L(pk)  
D
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
260  
°C  
L
A
Y
= Assembly Location  
= Year  
= Work Week  
= Lot Traceability  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
W
ZZ  
THERMAL RESISTANCE MAXIMUM RATINGS (Note 1)  
Parameter  
Symbol  
Value  
Unit  
ORDERING INFORMATION  
Junction−to−Case − Steady State (Note 2)  
Junction−to−Ambient − Steady State (Note 2)  
R
1.95  
40  
°C/W  
q
q
JC  
Device  
Package  
Shipping  
R
JA  
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
2. Surface−mounted on FR4 board using a 650 mm , 2 oz. Cu pad.  
NTMFS4C022NT1G  
SO−8FL  
(Pb−Free)  
1500 /  
Tape & Reel  
2
3. Maximum current for pulses as long as 1 second is higher but is dependent  
on pulse duration and duty cycle.  
NTMFS4C022NT3G  
SO−8FL  
(Pb−Free)  
5000 /  
Tape & Reel  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
© Semiconductor Components Industries, LLC, 2016  
1
Publication Order Number:  
June, 2016 − Rev. 0  
NTMFS4C022N/D  
 

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