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NTMFS4C03N PDF预览

NTMFS4C03N

更新时间: 2024-11-21 01:12:11
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
6页 125K
描述
Power MOSFET Dual N−Channel

NTMFS4C03N 数据手册

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NTMFS4C03N  
Power MOSFET  
30 V, 2.1 mW, 136 A, Single NChannel,  
SO8FL  
Features  
Small Footprint (5x6 mm) for Compact Design  
http://onsemi.com  
Low R  
to Minimize Conduction Losses  
DS(on)  
Low Q and Capacitance to Minimize Driver Losses  
G
V
R
MAX  
I MAX  
D
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
(BR)DSS  
DS(ON)  
Compliant  
2.1 mW @ 10 V  
2.8 mW @ 4.5 V  
30 V  
136 A  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Parameter  
DraintoSource Voltage  
Symbol  
Value  
30  
Unit  
V
V
DSS  
D (5,6)  
GatetoSource Voltage  
V
"20  
136  
V
GS  
Continuous Drain Cur-  
T
T
= 25°C  
= 25°C  
I
A
C
D
rent R  
(Notes 1, 3)  
q
JC  
Steady  
State  
G (4)  
Power Dissipation  
(Notes 1, 3)  
P
64  
30  
W
A
C
D
R
q
JC  
Continuous Drain Cur-  
T = 25°C  
A
I
S (1,2,3)  
NCHANNEL MOSFET  
D
rent R  
3)  
(Notes 1, 2,  
q
JA  
Steady  
State  
Power Dissipation  
(Notes 1, 2, 3)  
T = 25°C  
A
P
3.1  
W
D
R
q
JA  
MARKING  
DIAGRAM  
Pulsed Drain Current  
T = 25°C, t = 10 ms  
I
DM  
900  
A
A
p
D
Operating Junction and Storage Temperature  
T , T  
55 to  
°C  
J
stg  
150  
S
S
S
G
D
D
1
4C03N  
AYWZZ  
Source Current (Body Diode)  
I
S
53  
A
SO8 FLAT LEAD  
CASE 488AA  
STYLE 1  
Single Pulse DraintoSource Avalanche  
E
AS  
549  
mJ  
Energy (I  
= 11 A)  
L(pk)  
D
Lead Temperature for Soldering Purposes  
T
260  
°C  
L
A
Y
W
ZZ  
= Assembly Location  
= Year  
= Work Week  
= Lot Traceability  
(1/8from case for 10 s)  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
THERMAL RESISTANCE MAXIMUM RATINGS (Note 1)  
Parameter  
Symbol  
Value  
Unit  
ORDERING INFORMATION  
JunctiontoCase Steady State (Note 2)  
JunctiontoAmbient Steady State (Note 2)  
R
1.95  
40  
°C/W  
q
JC  
Device  
Package  
Shipping  
R
q
JA  
NTMFS4C03NT1G  
SO8FL  
(PbFree)  
1500 /  
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
Tape & Reel  
2
2. Surfacemounted on FR4 board using a 650 mm , 2 oz. Cu pad.  
NTMFS4C03NT3G  
SO8FL  
(PbFree)  
5000 /  
3. Maximum current for pulses as long as 1 second is higher but is dependent  
on pulse duration and duty cycle.  
Tape & Reel  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
© Semiconductor Components Industries, LLC, 2014  
1
Publication Order Number:  
September, 2014 Rev. 0  
NTMFS4C03N/D  
 

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