NTMFS4C032N
Power MOSFET
30 V, 38 A, Single N−Channel, SO−8 FL
Features
• Low R
to Minimize Conduction Losses
DS(on)
• Low Capacitance to Minimize Driver Losses
• Optimized Gate Charge to Minimize Switching Losses
www.onsemi.com
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
V
R
MAX
I MAX
D
(BR)DSS
DS(ON)
Applications
7.35 mW @ 10 V
• CPU Power Delivery
• DC−DC Converters
30 V
38 A
11.15 mW @ 4.5 V
MAXIMUM RATINGS (T = 25°C unless otherwise stated)
J
D (5−8)
Parameter
Symbol
Value
Unit
Drain−to−Source Voltage
Gate−to−Source Voltage
V
30
20
V
V
A
DSS
V
GS
Continuous Drain
Current R
T = 25°C
I
D
13.0
A
G (4)
q
JA
T = 80°C
A
9.7
(Note 1)
Power Dissipation
(Note 1)
T = 25°C
A
P
2.46
W
A
D
D
D
D
S (1,2,3)
N−CHANNEL MOSFET
R
q
JA
Continuous Drain
T = 25°C
A
I
19.1
14.3
5.32
D
Current R
(Note 1)
≤ 10 s
q
JA
T = 80°C
A
MARKING
DIAGRAM
Power Dissipation
≤ 10 s (Note 1)
T = 25°C
A
P
I
W
A
R
q
JA
Steady
State
D
Continuous Drain
Current R
T = 25°C
A
7.2
5.4
D
S
S
S
G
D
D
q
JA
4C032
AYWZZ
1
T = 80°C
A
(Note 2)
Power Dissipation
(Note 2)
SO−8 FLAT LEAD
CASE 488AA
STYLE 1
T = 25°C
A
P
I
0.75
W
A
R
q
JA
D
Continuous Drain
Current R
T
= 25°C
=80°C
= 25°C
38
29
C
D
q
JC
A
Y
= Assembly Location
= Year
T
T
C
(Note 1)
Power Dissipation
(Note 1)
P
21.6
W
W
ZZ
= Work Week
= Lot Traceabililty
C
R
q
JC
Pulsed Drain Current
T = 25°C, t = 10 ms
I
DM
106
70
A
A
A
p
Current Limited by Package
T = 25°C
A
I
Dmax
ORDERING INFORMATION
Operating Junction and Storage
Temperature
T ,
−55 to
+150
°C
J
T
STG
†
Device
Package
Shipping
Source Current (Body Diode)
Drain to Source DV/DT
I
S
19
7.0
22
A
NTMFS4C032NT1G
SO−8 FL
1500 /
dV/d
V/ns
mJ
t
(Pb−Free)
Tape & Reel
Single Pulse Drain−to−Source Avalanche
E
AS
Energy (T = 25°C, V = 10 V, I = 21 A ,
NTMFS4C032NT3G
SO−8 FL
(Pb−Free)
5000 /
Tape & Reel
J
GS
L
pk
L = 0.1 mH, R = 25 W) (Note 3)
GS
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T
260
°C
L
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Surface−mounted on FR4 board using 1 sq−in pad, 1 oz Cu.
2. Surface−mounted on FR4 board using the minimum recommended pad size.
3. This is the absolute maximum rating. Parts are 100% tested at T = 25°C,
J
V
GS
= 10 V, I = 15 Apk, E = 11 mJ.
L AS
© Semiconductor Components Industries, LLC, 2016
1
Publication Order Number:
August, 2016 − Rev. 1
NTMFS4C032N/D