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NTMFS4C032N PDF预览

NTMFS4C032N

更新时间: 2024-11-21 01:13:55
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安森美 - ONSEMI /
页数 文件大小 规格书
7页 86K
描述
Power MOSFET

NTMFS4C032N 数据手册

 浏览型号NTMFS4C032N的Datasheet PDF文件第2页浏览型号NTMFS4C032N的Datasheet PDF文件第3页浏览型号NTMFS4C032N的Datasheet PDF文件第4页浏览型号NTMFS4C032N的Datasheet PDF文件第5页浏览型号NTMFS4C032N的Datasheet PDF文件第6页浏览型号NTMFS4C032N的Datasheet PDF文件第7页 
NTMFS4C032N  
Power MOSFET  
30 V, 38 A, Single N−Channel, SO−8 FL  
Features  
Low R  
to Minimize Conduction Losses  
DS(on)  
Low Capacitance to Minimize Driver Losses  
Optimized Gate Charge to Minimize Switching Losses  
www.onsemi.com  
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS  
Compliant  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
Applications  
7.35 mW @ 10 V  
CPU Power Delivery  
DC−DC Converters  
30 V  
38 A  
11.15 mW @ 4.5 V  
MAXIMUM RATINGS (T = 25°C unless otherwise stated)  
J
D (5−8)  
Parameter  
Symbol  
Value  
Unit  
Drain−to−Source Voltage  
Gate−to−Source Voltage  
V
30  
20  
V
V
A
DSS  
V
GS  
Continuous Drain  
Current R  
T = 25°C  
I
D
13.0  
A
G (4)  
q
JA  
T = 80°C  
A
9.7  
(Note 1)  
Power Dissipation  
(Note 1)  
T = 25°C  
A
P
2.46  
W
A
D
D
D
D
S (1,2,3)  
N−CHANNEL MOSFET  
R
q
JA  
Continuous Drain  
T = 25°C  
A
I
19.1  
14.3  
5.32  
D
Current R  
(Note 1)  
10 s  
q
JA  
T = 80°C  
A
MARKING  
DIAGRAM  
Power Dissipation  
10 s (Note 1)  
T = 25°C  
A
P
I
W
A
R
q
JA  
Steady  
State  
D
Continuous Drain  
Current R  
T = 25°C  
A
7.2  
5.4  
D
S
S
S
G
D
D
q
JA  
4C032  
AYWZZ  
1
T = 80°C  
A
(Note 2)  
Power Dissipation  
(Note 2)  
SO−8 FLAT LEAD  
CASE 488AA  
STYLE 1  
T = 25°C  
A
P
I
0.75  
W
A
R
q
JA  
D
Continuous Drain  
Current R  
T
= 25°C  
=80°C  
= 25°C  
38  
29  
C
D
q
JC  
A
Y
= Assembly Location  
= Year  
T
T
C
(Note 1)  
Power Dissipation  
(Note 1)  
P
21.6  
W
W
ZZ  
= Work Week  
= Lot Traceabililty  
C
R
q
JC  
Pulsed Drain Current  
T = 25°C, t = 10 ms  
I
DM  
106  
70  
A
A
A
p
Current Limited by Package  
T = 25°C  
A
I
Dmax  
ORDERING INFORMATION  
Operating Junction and Storage  
Temperature  
T ,  
−55 to  
+150  
°C  
J
T
STG  
Device  
Package  
Shipping  
Source Current (Body Diode)  
Drain to Source DV/DT  
I
S
19  
7.0  
22  
A
NTMFS4C032NT1G  
SO−8 FL  
1500 /  
dV/d  
V/ns  
mJ  
t
(Pb−Free)  
Tape & Reel  
Single Pulse Drain−to−Source Avalanche  
E
AS  
Energy (T = 25°C, V = 10 V, I = 21 A ,  
NTMFS4C032NT3G  
SO−8 FL  
(Pb−Free)  
5000 /  
Tape & Reel  
J
GS  
L
pk  
L = 0.1 mH, R = 25 W) (Note 3)  
GS  
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
260  
°C  
L
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
1. Surface−mounted on FR4 board using 1 sq−in pad, 1 oz Cu.  
2. Surface−mounted on FR4 board using the minimum recommended pad size.  
3. This is the absolute maximum rating. Parts are 100% tested at T = 25°C,  
J
V
GS  
= 10 V, I = 15 Apk, E = 11 mJ.  
L AS  
© Semiconductor Components Industries, LLC, 2016  
1
Publication Order Number:  
August, 2016 − Rev. 1  
NTMFS4C032N/D  
 

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