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NTMFS4985NFT1G

更新时间: 2024-11-20 12:49:15
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
7页 120K
描述
Power MOSFET 30 V, 65 A, Single N−Channel, SO−8 FL

NTMFS4985NFT1G 技术参数

是否无铅: 不含铅生命周期:Active
零件包装代码:DFN包装说明:SMALL OUTLINE, R-PDSO-F5
针数:5Reach Compliance Code:not_compliant
ECCN代码:EAR99Factory Lead Time:2 weeks
风险等级:1.48雪崩能效等级(Eas):54 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:30 V最大漏极电流 (Abs) (ID):65 A
最大漏极电流 (ID):17.5 A最大漏源导通电阻:0.005 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PDSO-F5
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:5
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):22.73 W
最大脉冲漏极电流 (IDM):195 A子类别:FET General Purpose Power
表面贴装:YES端子面层:Tin (Sn)
端子形式:FLAT端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

NTMFS4985NFT1G 数据手册

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NTMFS4985NF  
Power MOSFET  
30 V, 65 A, Single NChannel, SO8 FL  
Features  
Integrated Schottky Diode  
Low R  
to Minimize Conduction Losses  
Low Capacitance to Minimize Driver Losses  
DS(on)  
http://onsemi.com  
Optimized Gate Charge to Minimize Switching Losses  
These Devices are PbFree and are RoHS Compliant  
V
R
DS(ON)  
MAX  
I MAX  
D
(BR)DSS  
3.4 mW @ 10 V  
5.0 mW @ 4.5 V  
Applications  
CPU Power Delivery  
30 V  
65 A  
Synchronous Rectification for DCDC Converters  
Low Side Switching  
NCHANNEL MOSFET  
Telecom Secondary Side Rectification  
(5, 6)  
D
MAXIMUM RATINGS (T = 25°C unless otherwise stated)  
J
Parameter  
DraintoSource Voltage  
GatetoSource Voltage  
Symbol  
Value  
30  
Unit  
V
G
V
DSS  
V
20  
V
GS  
(4)  
Continuous Drain  
Current R  
I
D
A
T = 25°C  
23.9  
A
q
JA  
(1, 2, 3)  
S
T = 85°C  
A
17.2  
3.04  
(Note 1)  
Power Dissipation  
(Note 1)  
T = 25°C  
A
P
W
A
D
D
D
D
MARKING  
DIAGRAM  
R
q
JA  
Continuous Drain  
I
D
T = 25°C  
A
36  
26  
Current R  
10 sec  
v
D
q
JA  
T = 85°C  
A
S
S
S
G
D
D
1
Power Dissipation  
T = 25°C  
A
P
I
7.0  
W
A
4985NF  
AYWZZ  
R
t v 10 sec  
q
JA,  
SO8 FLAT LEAD  
CASE 488AA  
STYLE 1  
Steady  
State  
Continuous Drain  
T = 25°C  
A
17.5  
12.6  
1.63  
D
Current R  
(Note 2)  
q
D
JA  
T = 85°C  
A
4895NF = Specific Device Code  
Power Dissipation  
(Note 2)  
T = 25°C  
A
P
I
W
A
A
Y
W
ZZ  
= Assembly Location  
= Year  
= Work Week  
= Lot Traceability  
R
q
JA  
Continuous Drain  
Current R  
T
C
T
C
T
C
= 25°C  
= 85°C  
= 25°C  
65  
47  
D
q
JC  
(Note 1)  
Power Dissipation  
(Note 1)  
P
22.73  
W
A
R
q
JC  
ORDERING INFORMATION  
Pulsed Drain  
Current  
t =10ms  
p
T = 25°C  
A
I
DM  
195  
100  
Device  
Package  
Shipping  
Current limited by package  
T = 25°C  
A
I
A
Dmaxpkg  
NTMFS4985NFT1G  
SO8FL  
(PbFree)  
1500 /  
Operating Junction and Storage  
Temperature  
T ,  
55 to  
+150  
°C  
J
Tape & Reel  
T
STG  
NTMFS4985NFT3G  
SO8FL  
(PbFree)  
5000 /  
Tape & Reel  
Source Current (Body Diode)  
Drain to Source dV/dt  
I
64  
6
A
S
dV/dt  
EAS  
V/ns  
mJ  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
Single Pulse DraintoSource Avalanche  
Energy (V = 50 V, V = 10 V, I = 33 A ,  
pk  
54  
DD  
GS  
L
L = 0.1 mH, R = 25 W)  
G
Lead Temperature for Soldering Purposes  
(1/8” from case for 10 s)  
T
260  
°C  
L
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
*For additional information on our PbFree strategy  
and soldering details, please download the ON  
Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
© Semiconductor Components Industries, LLC, 2012  
1
Publication Order Number:  
July, 2012 Rev. 2  
NTMFS4985NF/D  

NTMFS4985NFT1G 替代型号

型号 品牌 替代类型 描述 数据表
NTMFS4985NFT3G ONSEMI

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