NTMFS4985NF
Power MOSFET
30 V, 65 A, Single N−Channel, SO−8 FL
Features
• Integrated Schottky Diode
• Low R
to Minimize Conduction Losses
• Low Capacitance to Minimize Driver Losses
DS(on)
http://onsemi.com
• Optimized Gate Charge to Minimize Switching Losses
• These Devices are Pb−Free and are RoHS Compliant
V
R
DS(ON)
MAX
I MAX
D
(BR)DSS
3.4 mW @ 10 V
5.0 mW @ 4.5 V
Applications
• CPU Power Delivery
30 V
65 A
• Synchronous Rectification for DC−DC Converters
• Low Side Switching
N−CHANNEL MOSFET
• Telecom Secondary Side Rectification
(5, 6)
D
MAXIMUM RATINGS (T = 25°C unless otherwise stated)
J
Parameter
Drain−to−Source Voltage
Gate−to−Source Voltage
Symbol
Value
30
Unit
V
G
V
DSS
V
20
V
GS
(4)
Continuous Drain
Current R
I
D
A
T = 25°C
23.9
A
q
JA
(1, 2, 3)
S
T = 85°C
A
17.2
3.04
(Note 1)
Power Dissipation
(Note 1)
T = 25°C
A
P
W
A
D
D
D
D
MARKING
DIAGRAM
R
q
JA
Continuous Drain
I
D
T = 25°C
A
36
26
Current R
10 sec
v
D
q
JA
T = 85°C
A
S
S
S
G
D
D
1
Power Dissipation
T = 25°C
A
P
I
7.0
W
A
4985NF
AYWZZ
R
t v 10 sec
q
JA,
SO−8 FLAT LEAD
CASE 488AA
STYLE 1
Steady
State
Continuous Drain
T = 25°C
A
17.5
12.6
1.63
D
Current R
(Note 2)
q
D
JA
T = 85°C
A
4895NF = Specific Device Code
Power Dissipation
(Note 2)
T = 25°C
A
P
I
W
A
A
Y
W
ZZ
= Assembly Location
= Year
= Work Week
= Lot Traceability
R
q
JA
Continuous Drain
Current R
T
C
T
C
T
C
= 25°C
= 85°C
= 25°C
65
47
D
q
JC
(Note 1)
Power Dissipation
(Note 1)
P
22.73
W
A
R
q
JC
ORDERING INFORMATION
Pulsed Drain
Current
t =10ms
p
T = 25°C
A
I
DM
195
100
†
Device
Package
Shipping
Current limited by package
T = 25°C
A
I
A
Dmaxpkg
NTMFS4985NFT1G
SO−8FL
(Pb−Free)
1500 /
Operating Junction and Storage
Temperature
T ,
−55 to
+150
°C
J
Tape & Reel
T
STG
NTMFS4985NFT3G
SO−8FL
(Pb−Free)
5000 /
Tape & Reel
Source Current (Body Diode)
Drain to Source dV/dt
I
64
6
A
S
dV/dt
EAS
V/ns
mJ
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Single Pulse Drain−to−Source Avalanche
Energy (V = 50 V, V = 10 V, I = 33 A ,
pk
54
DD
GS
L
L = 0.1 mH, R = 25 W)
G
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
T
260
°C
L
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
*For additional information on our Pb−Free strategy
and soldering details, please download the ON
Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2012
1
Publication Order Number:
July, 2012 − Rev. 2
NTMFS4985NF/D