NTD6415AN
N-Channel Power MOSFET
100 V, 23 A, 55 mW
Features
• Low R
DS(on)
• High Current Capability
http://onsemi.com
• 100% Avalanche Tested
• These Devices are Pb−Free and are RoHS Compliant
I
MAX
D
V
R
MAX
DS(on)
(Note 1)
(BR)DSS
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
Parameter
Drain−to−Source Voltage
Gate−to−Source Voltage − Continuous
Symbol
Value
100
$20
23
Unit
V
100 V
55 mW @ 10 V
23 A
V
DSS
V
GS
V
N−Channel
Continuous Drain
Current R
Steady
State
T
= 25°C
= 100°C
= 25°C
I
D
A
C
D
q
JC
T
C
16
Power Dissipation
R
Steady
State
T
C
P
D
83
W
q
JC
G
Pulsed Drain Current
t = 10 ms
p
I
89
A
DM
Operating and Storage Temperature Range
T , T
−55 to
+175
°C
J
stg
S
Source Current (Body Diode)
I
23
79
A
S
4
Single Pulse Drain−to−Source Avalanche
E
AS
mJ
Energy (V = 50 Vdc, V = 10 Vdc, I =
DD
GS
L(pk)
23 A, L = 0.3 mH, R = 25 W)
4
G
Lead Temperature for Soldering
Purposes, 1/8″ from Case for 10 Seconds
T
L
260
°C
1
2
1
2
3
3
THERMAL RESISTANCE RATINGS
Parameter
DPAK
CASE 369AA
STYLE 2
IPAK
CASE 369D
STYLE 2
Symbol
Max
1.8
39
Unit
Junction−to−Case (Drain) Steady State
Junction−to−Ambient (Note 1)
R
°C/W
q
JC
R
q
JA
MARKING DIAGRAM
& PIN ASSIGNMENTS
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface mounted on FR4 board using 1 sq in pad size,
4 Drain
4 Drain
(Cu Area 1.127 sq in [2 oz] including traces).
1
Gate
3
2
Source
1
3
Drain
Gate
Source
2
Drain
6415AN = Device Code
Y
= Year
WW
G
= Work Week
= Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
© Semiconductor Components Industries, LLC, 2009
1
Publication Order Number:
November, 2009 − Rev. 0
NTD6415AN/D