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NTD6416ANLT4G

更新时间: 2024-02-18 08:00:00
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
7页 136K
描述
N-Channel Power MOSFET 100 V, 19 A, 74 mΩ

NTD6416ANLT4G 技术参数

是否无铅: 不含铅生命周期:Active
包装说明:DPAK-4针数:4
Reach Compliance Code:not_compliantECCN代码:EAR99
Factory Lead Time:1 week风险等级:1.49
雪崩能效等级(Eas):50 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:100 V
最大漏极电流 (Abs) (ID):19 A最大漏极电流 (ID):19 A
最大漏源导通电阻:0.074 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PDSO-G2JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:2工作模式:ENHANCEMENT MODE
最高工作温度:175 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):71 W最大脉冲漏极电流 (IDM):70 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:YES端子面层:Tin (Sn)
端子形式:GULL WING端子位置:DUAL
处于峰值回流温度下的最长时间:40晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

NTD6416ANLT4G 数据手册

 浏览型号NTD6416ANLT4G的Datasheet PDF文件第2页浏览型号NTD6416ANLT4G的Datasheet PDF文件第3页浏览型号NTD6416ANLT4G的Datasheet PDF文件第4页浏览型号NTD6416ANLT4G的Datasheet PDF文件第5页浏览型号NTD6416ANLT4G的Datasheet PDF文件第6页浏览型号NTD6416ANLT4G的Datasheet PDF文件第7页 
NTD6416ANL  
N-Channel Power MOSFET  
100 V, 19 A, 74 mW  
Features  
Low R  
DS(on)  
High Current Capability  
100% Avalanche Tested  
These are PbFree Devices  
http://onsemi.com  
V
R
DS(on)  
MAX  
I MAX  
D
(BR)DSS  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Parameter  
DraintoSource Voltage  
GatetoSource Voltage Continuous  
Symbol  
Value  
100  
$20  
19  
Unit  
V
100 V  
74 mW @ 10 V  
19 A  
V
DSS  
V
V
GS  
D
Continuous Drain  
Current  
Steady  
State  
T
= 25°C  
= 100°C  
= 25°C  
I
D
A
C
T
C
13  
Power Dissipation  
Steady  
State  
T
C
P
71  
W
D
G
Pulsed Drain Current  
t = 10 ms  
I
70  
A
p
DM  
S
Operating and Storage Temperature Range  
T , T  
J
55 to  
+175  
°C  
stg  
4
Source Current (Body Diode)  
I
19  
50  
A
4
S
Single Pulse DraintoSource Avalanche  
E
mJ  
AS  
Energy (V = 50 Vdc, V = 10 Vdc, I =  
DD  
GS  
L(pk)  
2
1
1
18.2 A, L = 0.3 mH, R = 25 W)  
G
3
2
3
Lead Temperature for Soldering  
T
260  
°C  
L
DPAK  
CASE 369AA  
STYLE 2  
IPAK  
CASE 369D  
STYLE 2  
Purposes, 1/8from Case for 10 Seconds  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
Max  
2.1  
47  
Unit  
MARKING DIAGRAM  
& PIN ASSIGNMENTS  
JunctiontoCase (Drain) Steady State  
R
q
°C/W  
JC  
JunctiontoAmbient Steady State (Note 1)  
R
q
JA  
4 Drain  
4 Drain  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. Surface mounted on FR4 board using 1 sq in pad size,  
(Cu Area 1.127 sq in [2 oz] including traces).  
1
Gate  
3
2
Source  
1
3
Drain  
Gate  
Source  
2
Drain  
6416ANL = Device Code  
Y
= Year  
WW  
G
= Work Week  
= PbFree Package  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 5 of this data sheet.  
© Semiconductor Components Industries, LLC, 2009  
1
Publication Order Number:  
October, 2009 Rev. 0  
NTD6416ANL/D  
 

NTD6416ANLT4G 替代型号

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