NCP5387
2/3/4 Phase Controller for
CPU Applications
The NCP5387 is a two−, three−, or four−phase buck controller
which combines differential voltage and current sensing, and
adaptive voltage positioning to power both AMD and Intel
processors. Dual−edge pulse−width modulation (PWM) combined
with inductor current sensing reduces system cost by providing the
fastest initial response to transient load events. Dual−edge
multi−phase modulation reduces total bulk and ceramic output
capacitance required to satisfy transient load−line regulation.
A high performance operational error amplifier is provided, which
allows easy compensation of the system. The proprietary method of
Dynamic Reference Injection (Patented) makes the error amplifier
compensation virtually independent of the system response to VID
changes, eliminating tradeoffs between overshoot and dynamic VID
performance.
http://onsemi.com
MARKING
DIAGRAM
1
1
40
NCP5387
AAWLYYWW
G
40 PIN QFN, 6x6
MN SUFFIX
CASE 488AR
Features
NCP5387 = Specific Device Code
• Meets Intel’s VR 10.0 and 11.0 and AMD Specifications
• Dual−Edge PWM for Fastest Initial Response to Transient Loading
• High Performance Operational Error Amplifier
• Supports both VR11 and Legacy Soft−Start Modes
• Dynamic Reference Injection (Patented)
• DAC Range from 0.5 V to 1.6 V
AA
WL
YY
WW
G/G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
*Pin 41 is the thermal pad on the bottom of the device.
• ꢀ 0.5% System Voltage Accuracy from 1.0 V to 1.6 V
• True Differential Remote Voltage Sensing Amplifier
• Phase−to−Phase Current Balancing
ORDERING INFORMATION
†
Device
Package
Shipping
• “Lossless” Differential Inductor Current Sensing
• Differential Current Sense Amplifiers for each Phase
• Adaptive Voltage Positioning (AVP)
NCP5387MNR2G* QFN−40 2500 / Tape & Reel
(Pb−Free)
*TemperatureRange: 0°C to 85°C
• Frequency Range: 100 kHz – 1.0 MHz
• OVP with Resettable, 8 Event Delayed Latch
• Threshold Sensitive Enable Pin for VTT Sensing
• Power Good Output with Internal Delays
• Programmable Soft−Start Time
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
• This is a Pb−Free Device*
Applications
• Desktop Processors
*For additional information on our Pb−Free strategy and soldering details, please
downloadthe ON Semiconductor Soldering and Mounting Techniques Reference
Manual, SOLDERRM/D.
©
Semiconductor Components Industries, LLC, 2007
1
Publication Order Number:
April, 2007 − Rev. 3
NCP5387/D