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MMQA5V6T3 PDF预览

MMQA5V6T3

更新时间: 2024-11-02 20:27:23
品牌 Logo 应用领域
摩托罗拉 - MOTOROLA /
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8页 104K
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MMQA5V6T3 数据手册

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Order this document  
by MMQA/D  
SEMICONDUCTOR TECHNICAL DATA  
Motorola Preferred Devices  
Transient Voltage Suppressor  
for ESD Protection  
SC-59 QUAD  
TRANSIENT VOLTAGE  
SUPPRESSOR  
24 WATTS PEAK POWER  
5.6 – 33 VOLTS  
This quad monolithic silicon voltage suppressor is designed for applications  
requiring transient overvoltage protection capability. It is intended for use in  
voltage and ESD sensitive equipment such as computers, printers, business  
machines, communication systems, medical equipment, and other applica-  
tions. Its quad junction common anode design protects four separate lines  
using only one package. These devices are ideal for situations where board  
space is at a premium.  
6
5
4
1
2
3
Specification Features:  
SC-59 Package Allows Four Separate Unidirectional Configurations  
Peak Power — Min. 24 W @ 1.0 ms (Unidirectional), per Figure 5 Waveform  
Peak Power — Min. 150 W @ 20 s (Unidirectional), per Figure 6 Waveform  
Maximum Clamping Voltage @ Peak Pulse Current  
CASE 318F-01  
STYLE 1  
SC-59 PLASTIC  
Low Leakage < 2.0 µA  
ESD Rating of Class N (exceeding 16 kV) per the Human Body Model  
1
2
3
6
5
4
Mechanical Characteristics:  
Void Free, Transfer-Molded, Thermosetting Plastic Case  
Corrosion Resistant Finish, Easily Solderable  
Package Designed for Optimal Automated Board Assembly  
Small Package Size for High Density Applications  
Available in 8 mm Tape and Reel  
PIN 1. CATHODE  
2. ANODE  
Use the Device Number to order the 7 inch/3,000 unit reel. Replace  
with “T3” in the Device Number to order the 13 inch/10,000 unit reel.  
3. CATHODE  
4. CATHODE  
5. ANODE  
6. CATHODE  
THERMAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
A
Characteristic  
Symbol  
Value  
24  
Unit  
Watts  
Watts  
Peak Power Dissipation @ 1.0 ms (1) @ T 25°C  
P
P
A
pk  
Peak Power Dissipation @ 20 s (2) @ T 25°C  
150  
A
pk  
Total Power Dissipation on FR-5 Board (3) @ T = 25°C  
°P  
D
°
°225  
1.8  
°mW°  
mW/°C  
A
Thermal Resistance from Junction to Ambient  
R
556  
°C/W  
θJA  
Total Power Dissipation on Alumina Substrate (4) @ T = 25°C  
Derate above 25°C  
°P  
D
°
°300  
2.4  
°mW  
mW/°C  
A
Thermal Resistance from Junction to Ambient  
Junction and Storage Temperature Range  
Lead Solder Temperature — Maximum (10 Second Duration)  
R
417  
°C/W  
°C  
θJA  
T , T  
J
°– 55 to +150°  
stg  
T
260  
°C  
L
1. Non-repetitive current pulse per Figure 5 and derate above T = 25°C per Figure 4.  
A
2. Non-repetitive current pulse per Figure 6 and derate above T = 25°C per Figure 4.  
A
3. FR-5 = 1.0 x 0.75 x 0.62 in.  
4. Alumina = 0.4 x 0.3 x 0.024 in., 99.5% alumina  
Preferred devices are Motorola recommended choices for future use and best overall value.  
Thermal Clad is a trademark of the Bergquist Company  
Motorola, Inc. 1996  

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