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SEMICONDUCTOR TECHNICAL DATA
Motorola Preferred Devices
Transient Voltage Suppressor
for ESD Protection
SC-59 QUAD
TRANSIENT VOLTAGE
SUPPRESSOR
24 WATTS PEAK POWER
5.6 – 33 VOLTS
This quad monolithic silicon voltage suppressor is designed for applications
requiring transient overvoltage protection capability. It is intended for use in
voltage and ESD sensitive equipment such as computers, printers, business
machines, communication systems, medical equipment, and other applica-
tions. Its quad junction common anode design protects four separate lines
using only one package. These devices are ideal for situations where board
space is at a premium.
6
5
4
1
2
3
Specification Features:
•
•
•
•
•
•
SC-59 Package Allows Four Separate Unidirectional Configurations
Peak Power — Min. 24 W @ 1.0 ms (Unidirectional), per Figure 5 Waveform
Peak Power — Min. 150 W @ 20 s (Unidirectional), per Figure 6 Waveform
Maximum Clamping Voltage @ Peak Pulse Current
CASE 318F-01
STYLE 1
SC-59 PLASTIC
Low Leakage < 2.0 µA
ESD Rating of Class N (exceeding 16 kV) per the Human Body Model
1
2
3
6
5
4
Mechanical Characteristics:
•
•
•
•
•
Void Free, Transfer-Molded, Thermosetting Plastic Case
Corrosion Resistant Finish, Easily Solderable
Package Designed for Optimal Automated Board Assembly
Small Package Size for High Density Applications
Available in 8 mm Tape and Reel
PIN 1. CATHODE
2. ANODE
Use the Device Number to order the 7 inch/3,000 unit reel. Replace
with “T3” in the Device Number to order the 13 inch/10,000 unit reel.
3. CATHODE
4. CATHODE
5. ANODE
6. CATHODE
THERMAL CHARACTERISTICS (T = 25°C unless otherwise noted)
A
Characteristic
Symbol
Value
24
Unit
Watts
Watts
Peak Power Dissipation @ 1.0 ms (1) @ T ≤ 25°C
P
P
A
pk
Peak Power Dissipation @ 20 s (2) @ T ≤ 25°C
150
A
pk
Total Power Dissipation on FR-5 Board (3) @ T = 25°C
°P
D
°
°225
1.8
°mW°
mW/°C
A
Thermal Resistance from Junction to Ambient
R
556
°C/W
θJA
Total Power Dissipation on Alumina Substrate (4) @ T = 25°C
Derate above 25°C
°P
D
°
°300
2.4
°mW
mW/°C
A
Thermal Resistance from Junction to Ambient
Junction and Storage Temperature Range
Lead Solder Temperature — Maximum (10 Second Duration)
R
417
°C/W
°C
θJA
T , T
J
°– 55 to +150°
stg
T
260
°C
L
1. Non-repetitive current pulse per Figure 5 and derate above T = 25°C per Figure 4.
A
2. Non-repetitive current pulse per Figure 6 and derate above T = 25°C per Figure 4.
A
3. FR-5 = 1.0 x 0.75 x 0.62 in.
4. Alumina = 0.4 x 0.3 x 0.024 in., 99.5% alumina
Preferred devices are Motorola recommended choices for future use and best overall value.
Thermal Clad is a trademark of the Bergquist Company
Motorola, Inc. 1996
MOTOROLA
1
MMQA Series