MMBFJ175LT1
Preferred Device
JFET Chopper
P−Channel − Depletion
Features
• Pb−Free Package is Available
http://onsemi.com
2 SOURCE
MAXIMUM RATINGS
Rating
Drain−Gate Voltage
Symbol
Value
25
Unit
V
3
V
DG
GATE
Reverse Gate−Source Voltage
V
−25
V
GS(r)
THERMAL CHARACTERISTICS
1 DRAIN
Characteristic
Symbol
Max
Unit
Total Device Dissipation FR−5 Board,
P
D
(Note 1) T = 25°C
225
1.8
mW
mW/°C
A
3
Derate above 25°C
SOT−23 (TO−236)
CASE 318
1
Thermal Resistance, Junction−to−Ambient
Junction and Storage Temperature
R
556
°C/W
°C
q
JA
STYLE 10
2
T , T
J
−55 to +150
stg
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
MARKING DIAGRAM
1. FR−5 = 1.0 x 0.75 x 0.062 in.
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)
A
6W M G
Characteristic
OFF CHARACTERISTICS
Symbol Min Max
Unit
G
1
Gate−Source Breakdown Voltage
V
30
−
−
V
nA
V
(BR)GSS
(V = 0, I = 1.0 mA)
DS
D
Gate Reverse Current
(V = 0 V, V = 20 V)
I
1.0
6.0
GSS
DS
GS
6W = Device Code
M
= Date Code*
Gate−Source Cutoff Voltage
(V = 15, I = 10 nA)
V
3.0
GS(OFF)
G
= Pb−Free Package
DS
D
(Note: Microdot may be in either location)
ON CHARACTERISTICS
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
Zero Gate−Voltage Drain Current (Note 2)
I
7.0
−
60
1.0
125
mA
nA
W
DSS
(V = 0, V = 15 V)
GS
DS
Drain Cutoff Current
(V = 15 V, V = 10 V)
I
D(off)
ORDERING INFORMATION
DS
GS
†
Device
Package
Shipping
Drain Source On Resistance
r
−
DS(on)
MMBFJ175LT1
SOT−23 3,000 / Tape & Reel
(I = 500 mA)
D
Input Capacitance
C
−
−
11
MMBFJ175LT1G SOT−23 3,000 / Tape & Reel
(Pb−Free)
iss
V
DS
= 0, V = 10V
f = 1.0 MHz
GS
pF
Reverse Transfer
Capacitance
C
rss
5.5
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
2. Pulse Test: Pulse Width v 300 ms, Duty Cycle v 2.0%.
Preferred devices are recommended choices for future use
and best overall value.
©
Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
February, 2006 − Rev. 3
MMBFJ175LT1/D