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MMBFJ175LT1_06 PDF预览

MMBFJ175LT1_06

更新时间: 2024-02-16 10:30:05
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
2页 42K
描述
JFET Chopper P-Channel - Depletion

MMBFJ175LT1_06 数据手册

 浏览型号MMBFJ175LT1_06的Datasheet PDF文件第2页 
MMBFJ175LT1  
Preferred Device  
JFET Chopper  
P−Channel − Depletion  
Features  
Pb−Free Package is Available  
http://onsemi.com  
2 SOURCE  
MAXIMUM RATINGS  
Rating  
Drain−Gate Voltage  
Symbol  
Value  
25  
Unit  
V
3
V
DG  
GATE  
Reverse Gate−Source Voltage  
V
−25  
V
GS(r)  
THERMAL CHARACTERISTICS  
1 DRAIN  
Characteristic  
Symbol  
Max  
Unit  
Total Device Dissipation FR−5 Board,  
P
D
(Note 1) T = 25°C  
225  
1.8  
mW  
mW/°C  
A
3
Derate above 25°C  
SOT−23 (TO−236)  
CASE 318  
1
Thermal Resistance, Junction−to−Ambient  
Junction and Storage Temperature  
R
556  
°C/W  
°C  
q
JA  
STYLE 10  
2
T , T  
J
−55 to +150  
stg  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits are  
exceeded, device functional operation is not implied, damage may occur and  
reliability may be affected.  
MARKING DIAGRAM  
1. FR−5 = 1.0 x 0.75 x 0.062 in.  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
A
6W M G  
Characteristic  
OFF CHARACTERISTICS  
Symbol Min Max  
Unit  
G
1
GateSource Breakdown Voltage  
V
30  
V
nA  
V
(BR)GSS  
(V = 0, I = 1.0 mA)  
DS  
D
Gate Reverse Current  
(V = 0 V, V = 20 V)  
I
1.0  
6.0  
GSS  
DS  
GS  
6W = Device Code  
M
= Date Code*  
GateSource Cutoff Voltage  
(V = 15, I = 10 nA)  
V
3.0  
GS(OFF)  
G
= Pb−Free Package  
DS  
D
(Note: Microdot may be in either location)  
ON CHARACTERISTICS  
*Date Code orientation and/or overbar may  
vary depending upon manufacturing location.  
Zero GateVoltage Drain Current (Note 2)  
I
7.0  
60  
1.0  
125  
mA  
nA  
W
DSS  
(V = 0, V = 15 V)  
GS  
DS  
Drain Cutoff Current  
(V = 15 V, V = 10 V)  
I
D(off)  
ORDERING INFORMATION  
DS  
GS  
Device  
Package  
Shipping  
Drain Source On Resistance  
r
DS(on)  
MMBFJ175LT1  
SOT−23 3,000 / Tape & Reel  
(I = 500 mA)  
D
Input Capacitance  
C
11  
MMBFJ175LT1G SOT−23 3,000 / Tape & Reel  
(Pb−Free)  
iss  
V
DS  
= 0, V = 10V  
f = 1.0 MHz  
GS  
pF  
Reverse Transfer  
Capacitance  
C
rss  
5.5  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
2. Pulse Test: Pulse Width v 300 ms, Duty Cycle v 2.0%.  
Preferred devices are recommended choices for future use  
and best overall value.  
©
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
February, 2006 − Rev. 3  
MMBFJ175LT1/D  
 

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