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MH32S64R3N-8 PDF预览

MH32S64R3N-8

更新时间: 2024-11-05 19:42:51
品牌 Logo 应用领域
三菱 - MITSUBISHI 静态存储器内存集成电路
页数 文件大小 规格书
1页 95K
描述
SRAM Module, 32KX64, 8ns, CMOS

MH32S64R3N-8 技术参数

生命周期:Obsolete包装说明:,
Reach Compliance Code:unknownECCN代码:3A991.B.2.A
HTS代码:8542.32.00.41风险等级:5.82
最长访问时间:8 nsJESD-30 代码:R-XXMA-X
内存密度:2097152 bit内存集成电路类型:SRAM MODULE
内存宽度:64功能数量:1
字数:32768 words字数代码:32000
组织:32KX64封装主体材料:UNSPECIFIED
封装形状:RECTANGULAR封装形式:MICROELECTRONIC ASSEMBLY
认证状态:Not Qualified表面贴装:NO
技术:CMOS端子形式:UNSPECIFIED
端子位置:UNSPECIFIEDBase Number Matches:1

MH32S64R3N-8 数据手册

  

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