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MH16S64ZJJ-10 PDF预览

MH16S64ZJJ-10

更新时间: 2024-11-18 20:38:19
品牌 Logo 应用领域
三菱 - MITSUBISHI 动态存储器内存集成电路
页数 文件大小 规格书
55页 539K
描述
Synchronous DRAM Module, 16MX64, 8ns, CMOS, DIP-72

MH16S64ZJJ-10 技术参数

生命周期:Obsolete零件包装代码:DMA
包装说明:,针数:72
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.32.00.32风险等级:5.84
访问模式:FOUR BANK PAGE BURST最长访问时间:8 ns
JESD-30 代码:R-XDMA-N144内存密度:1073741824 bit
内存集成电路类型:SYNCHRONOUS DRAM MODULE内存宽度:64
功能数量:1端口数量:1
端子数量:144字数:16777216 words
字数代码:16000000工作模式:SYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:16MX64封装主体材料:UNSPECIFIED
封装形状:RECTANGULAR封装形式:MICROELECTRONIC ASSEMBLY
认证状态:Not Qualified最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):3 V标称供电电压 (Vsup):3.3 V
表面贴装:NO技术:CMOS
温度等级:COMMERCIAL端子形式:NO LEAD
端子位置:DUALBase Number Matches:1

MH16S64ZJJ-10 数据手册

 浏览型号MH16S64ZJJ-10的Datasheet PDF文件第2页浏览型号MH16S64ZJJ-10的Datasheet PDF文件第3页浏览型号MH16S64ZJJ-10的Datasheet PDF文件第4页浏览型号MH16S64ZJJ-10的Datasheet PDF文件第5页浏览型号MH16S64ZJJ-10的Datasheet PDF文件第6页浏览型号MH16S64ZJJ-10的Datasheet PDF文件第7页 
Preliminary Spec.  
MITSUBISHI LSIs  
Some contents are subject to change without notice.  
MH16S64ZJJ -7,-8A,-8,-10,-10L  
1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM  
DESCRIPTION  
Utilizes industry standard 16M x 8 Synchronous DRAMs  
The MH16S64ZJJ is 16777216 - word by 64-bit  
Synchronous DRAM module. This consists of eight  
industry standard 16Mx8 Synchronous DRAMs in  
TSOP and one industory standard EEPROM in  
TSSOP.  
TSOP and industry standard EEPROM in TSSOP  
144-pin (72-pin dual in-line package)  
single 3.3V±0.3V power supply  
The mounting of TSOP on a card edge Dual Inline  
package provides any application where high  
densities and large quantities of memory are  
required.  
This is a socket type - memory modules, suitable for  
easy interchange or addition of modules.  
Clock frequency 125MHz(-8A),  
100MHz(-7,-8,-10(L))(max.)  
Fully synchronous operation referenced to clock rising  
edge  
4 bank operation controlled by BA0,1(Bank Address)  
/CAS latency- 2/3(programmable)  
Burst length- 1/2/4/8/Full Page(programmable)  
Burst type- sequential / interleave(programmable)  
Column access - random  
FEATURES  
CLK Access Time  
Frequency  
(Component SDRAM)  
-7  
-8A  
-8  
6.0ns(CL=3)  
6.0ns(CL=3)  
100MHz  
125MHz  
100MHz  
100MHz  
6.0ns(CL=3)  
8.0ns(CL=3)  
Auto precharge / All bank precharge controlled by A10  
Auto refresh and Self refresh  
-10/10L  
4096 refresh cycle /64ms  
LVTTL Interface  
APPLICATION  
main memory or graphic memory in computer systems  
PCB Outline  
(Front)  
(Back)  
1
2
143  
144  
MITSUBISHI  
ELECTRIC  
MIT-DS-0272-0.0I  
12. Oct.1998  
( 1 / 55 )  

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