5秒后页面跳转
| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| MC34901SEF | NXP |
获取价格 |
Transceiver, Physical Layer, Single CAN HS without wakeup,timeout, SOIC 8, Rail |
|
| MC34903CP3EK | NXP |
获取价格 |
System Basis Chip, 2x 3.3 V/400mA LDOs, 3 wakeup, SOIC 32, Rail |
|
| MC34903CP5EK | NXP |
获取价格 |
System Basis Chip, 2x 5.0 V/400mA LDOs, 3 wakeup, SOIC 32, Rail |
|
| MC34903CS3EK | NXP |
获取价格 |
System Basis Chip, LIN, 2x 3.3 V/400mA LDOs, 2/3 wakeup, SOIC 32, Rail |
|
| MC34903CS5EK | NXP |
获取价格 |
System Basis Chip, LIN, 2x 5.0 V/400mA LDOs, 2/3 wakeup, SOIC 32, Rail |
|
| MC34904C3EK | NXP |
获取价格 |
System Basis Chip, 2x 3.3 V/400mA LDOs, 4 wakeup, SOIC 32, Rail |
|
| MC34904C5EK | NXP |
获取价格 |
System Basis Chip, 2x 5.0 V/400mA LDOs, 4 wakeup, SOIC 32, Rail |
|
| MC34905CS3EK | NXP |
获取价格 |
System Basis Chip, LIN, 2x 3.3 V/400mA LDOs, 3/4 wakeup, SOIC 32, Rail |
|
| MC34905CS5EK | NXP |
获取价格 |
DATACOM, NETWORK INTERFACE SUPPORT CIRCUIT, PDSO32, 0.65 MM PITCH, ROHS COMPLIANT, SOIC-32 |
|
| MC34910BAC | FREESCALE |
获取价格 |
LIN System Basis Chip with 2x60mA High Side Drivers |
|
英伟达新AI芯片Rubin或提前半年亮相
苹果iPhone 17将全系采用三星/LG显示LTPO OLED面板
三星深化印度制造布局，供应链本地化进程加速
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
工作时间：9:00-21:00
CEO邮箱：ceo@jiepei.com
投诉邮箱：tousu@jiepei.com
微信公众号
抖音公众号
浙公网安备 33010502006866号 浙ICP备10014259号-119
营业执照ICP证
数据手册
如果您发现信息不准确，
