是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Transferred | 包装说明: | ROHS COMPLIANT, MS-012AA, SOIC-8 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.69 |
JESD-30 代码: | R-PDSO-G8 | JESD-609代码: | e3 |
长度: | 4.9 mm | 湿度敏感等级: | 3 |
功能数量: | 1 | 端子数量: | 8 |
最高工作温度: | 125 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | SOP |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE |
峰值回流温度(摄氏度): | 260 | 座面最大高度: | 1.75 mm |
标称供电电压: | 5 V | 表面贴装: | YES |
电信集成电路类型: | INTERFACE CIRCUIT | 温度等级: | AUTOMOTIVE |
端子面层: | MATTE TIN | 端子形式: | GULL WING |
端子节距: | 1.27 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | 40 | 宽度: | 3.9 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
MCP2562FD-E/SN | MICROCHIP |
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