是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Transferred | 包装说明: | 0.65 MM PITCH, ROHS COMPLIANT, SOIC-32 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.73 |
JESD-30 代码: | R-PDSO-G32 | JESD-609代码: | e3 |
长度: | 11 mm | 湿度敏感等级: | 3 |
功能数量: | 1 | 端子数量: | 32 |
最高工作温度: | 125 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | HSSOP |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH |
峰值回流温度(摄氏度): | 260 | 座面最大高度: | 2.45 mm |
标称供电电压: | 3.3 V | 表面贴装: | YES |
电信集成电路类型: | SUPPORT CIRCUIT | 温度等级: | AUTOMOTIVE |
端子面层: | Matte Tin (Sn) | 端子形式: | GULL WING |
端子节距: | 0.65 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | 40 | 宽度: | 7.5 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
MC34903CS5EK | NXP |
获取价格 |
System Basis Chip, LIN, 2x 5.0 V/400mA LDOs, 2/3 wakeup, SOIC 32, Rail | |
MC34904C3EK | NXP |
获取价格 |
System Basis Chip, 2x 3.3 V/400mA LDOs, 4 wakeup, SOIC 32, Rail | |
MC34904C5EK | NXP |
获取价格 |
System Basis Chip, 2x 5.0 V/400mA LDOs, 4 wakeup, SOIC 32, Rail | |
MC34905CS3EK | NXP |
获取价格 |
System Basis Chip, LIN, 2x 3.3 V/400mA LDOs, 3/4 wakeup, SOIC 32, Rail | |
MC34905CS5EK | NXP |
获取价格 |
DATACOM, NETWORK INTERFACE SUPPORT CIRCUIT, PDSO32, 0.65 MM PITCH, ROHS COMPLIANT, SOIC-32 | |
MC34910BAC | FREESCALE |
获取价格 |
LIN System Basis Chip with 2x60mA High Side Drivers | |
MC34910BAC | ROCHESTER |
获取价格 |
0.11A BUF OR INV BASED PRPHL DRVR, PQFP32, 7 X 7 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, ROHS C | |
MC34910BAC | NXP |
获取价格 |
System Basis Chip, LIN, 1x 5.0V/60mA LDOs, High-Side Drivers, QFP 32 | |
MC34910BAC,557 | NXP |
获取价格 |
Buffer/Inverter Based Peripheral Driver, 0.11A, PQFP32 | |
MC34910BACR2 | FREESCALE |
获取价格 |
LIN System Basis Chip with 2x60mA High Side Drivers |