是否Rohs认证: | 符合 | 生命周期: | Obsolete |
零件包装代码: | BGA | 包装说明: | LFBGA, |
针数: | 115 | Reach Compliance Code: | compliant |
HTS代码: | 8542.32.00.71 | 风险等级: | 5.69 |
其他特性: | FCRAM IS ORGANIZED AS 4M X 16; SRAM IS ORGANIZED AS 512K X 16; CONTAINS ADDITIONAL 4M X 16 FLASH | JESD-30 代码: | R-PBGA-B115 |
JESD-609代码: | e1 | 长度: | 12 mm |
内存密度: | 134217728 bit | 内存集成电路类型: | MEMORY CIRCUIT |
内存宽度: | 16 | 功能数量: | 1 |
端子数量: | 115 | 字数: | 8388608 words |
字数代码: | 8000000 | 工作模式: | ASYNCHRONOUS |
最高工作温度: | 85 °C | 最低工作温度: | -25 °C |
组织: | 8MX16 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | LFBGA | 封装形状: | RECTANGULAR |
封装形式: | GRID ARRAY, LOW PROFILE, FINE PITCH | 峰值回流温度(摄氏度): | 260 |
认证状态: | Not Qualified | 座面最大高度: | 1.35 mm |
最大供电电压 (Vsup): | 3.1 V | 最小供电电压 (Vsup): | 2.7 V |
标称供电电压 (Vsup): | 3 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | OTHER |
端子面层: | TIN SILVER COPPER | 端子形式: | BALL |
端子节距: | 0.8 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | 40 | 宽度: | 9 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
MB8501E064AD-60DG | FUJITSU |
获取价格 |
EDO DRAM Module, 1MX64, 60ns, CMOS, PDMA168 | |
MB8501E064AD-70DG | FUJITSU |
获取价格 |
EDO DRAM Module, 1MX64, 70ns, CMOS, PDMA168 | |
MB8501S064AC-100DG | FUJITSU |
获取价格 |
Synchronous DRAM Module, 1MX64, 8.5ns, CMOS, PDMA168 | |
MB8501S064AC-67DG | FUJITSU |
获取价格 |
Synchronous DRAM Module, 1MX64, 9ns, CMOS, PDMA168 | |
MB8501S064AC-84DG | FUJITSU |
获取价格 |
Synchronous DRAM Module, 1MX64, 8.5ns, CMOS, PDMA168 | |
MB8501S064AD-100DG | FUJITSU |
获取价格 |
Synchronous DRAM Module, 1MX64, 8.5ns, CMOS, PDMA144 | |
MB8501S064AD-67DG | FUJITSU |
获取价格 |
1MX64 SYNCHRONOUS DRAM MODULE, 9ns, PDMA144 | |
MB8501S064AD-84DG | FUJITSU |
获取价格 |
1MX64 SYNCHRONOUS DRAM MODULE, 8.5ns, PDMA144 | |
MB8501S064AE-100DG | FUJITSU |
获取价格 |
Synchronous DRAM Module, 1MX64, 8.5ns, CMOS, PZMA144 | |
MB8501S064AE-67DG | FUJITSU |
获取价格 |
Synchronous DRAM Module, 1MX64, 9ns, CMOS, PZMA144 |