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MB84VA2107-10 PDF预览

MB84VA2107-10

更新时间: 2024-09-16 22:46:27
品牌 Logo 应用领域
富士通 - FUJITSU 闪存存储内存集成电路静态存储器
页数 文件大小 规格书
29页 398K
描述
16M (x16) FLASH MEMORY & 1M (x 8) STATIC RAM

MB84VA2107-10 技术参数

是否Rohs认证: 不符合生命周期:Contact Manufacturer
包装说明:LBGA, BGA48,6X8,40Reach Compliance Code:compliant
HTS代码:8542.32.00.71风险等级:5.77
Is Samacsys:N最长访问时间:100 ns
其他特性:SRAM IS ORGANISED AS 128K X 8JESD-30 代码:R-PBGA-B48
JESD-609代码:e0长度:14 mm
内存密度:16777216 bit内存集成电路类型:MEMORY CIRCUIT
内存宽度:16混合内存类型:FLASH+SRAM
功能数量:1端子数量:48
字数:1048576 words字数代码:1000000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-20 °C组织:1MX16
封装主体材料:PLASTIC/EPOXY封装代码:LBGA
封装等效代码:BGA48,6X8,40封装形状:RECTANGULAR
封装形式:GRID ARRAY, LOW PROFILE峰值回流温度(摄氏度):NOT SPECIFIED
电源:3/3.3 V认证状态:Not Qualified
座面最大高度:1.6 mm最大待机电流:0.00003 A
子类别:Other Memory ICs最大压摆率:0.04 mA
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):2.7 V
表面贴装:YES技术:CMOS
温度等级:OTHER端子面层:Tin/Lead (Sn/Pb)
端子形式:BALL端子节距:1 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:10 mmBase Number Matches:1

MB84VA2107-10 数据手册

 浏览型号MB84VA2107-10的Datasheet PDF文件第2页浏览型号MB84VA2107-10的Datasheet PDF文件第3页浏览型号MB84VA2107-10的Datasheet PDF文件第4页浏览型号MB84VA2107-10的Datasheet PDF文件第5页浏览型号MB84VA2107-10的Datasheet PDF文件第6页浏览型号MB84VA2107-10的Datasheet PDF文件第7页 
FUJITSU SEMICONDUCTOR  
DATA SHEET  
DS05-50109-1E  
MCP (Multi-Chip Package) FLASH MEMORY & SRAM  
CMOS  
16M (×16) FLASH MEMORY &  
1M (× 8) STATIC RAM  
MB84VA2106-10/MB84VA2107-10  
FEATURES  
• Power supply voltage of 2.7 to 3.6 V  
• High performance  
100 ns maximum access time  
• Operating Temperature  
–20 to +85°C  
— FLASH MEMORY  
• Minimum 100,000 write/erase cycles  
• Sector erase architecture  
One 8 K word, two 4 K words, one 16 K word, and thirty one 32 K words.  
Any combination of sectors can be concurrently erased. Also supports full chip erase.  
• Boot Code Sector Architecture  
MB84VA2106: Top sector  
MB84VA2107: Bottom sector  
• Embedded EraseTM Algorithms  
Automatically pre-programs and erases the chip or any sector  
• Embedded ProgramTM Algorithms  
Automatically writes and verifies data at specified address  
• Data Polling and Toggle Bit feature for detection of program or erase cycle completion  
• Ready-Busy output (RY/BY)  
Hardware method for detection of program or erase cycle completion  
• Automatic sleep mode  
When addresses remain stable, automatically switch themselves to low power mode.  
• Low VCC write inhibit 2.5 V  
• Erase Suspend/Resume  
Suspends the erase operation to allow a read in another sector within the same device  
Please refer to "MBM29LV160T/B" data sheet in detailed function  
— SRAM  
• Power dissipation  
Operating: 35 mA max.  
Standby : 30 µA max.  
• Power down features using CE1s and CE2s  
• Data retention supply voltage: 2.0 V to 3.6 V  
Embedded EraseTM and Embedded ProgramTM are trademarks of Advanced Micro Devices, Inc.  

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