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MAAP-011388-DIE PDF预览

MAAP-011388-DIE

更新时间: 2024-11-19 14:54:43
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描述
E-Band Power Amplifier

MAAP-011388-DIE 数据手册

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E-Band Power Amplifier  
71 - 86 GHz, 1 W, High Linearity  
MAAP-011388-DIE  
Rev. V2  
Features  
Functional Schematic  
High Gain: 28 dB  
P1dB: 29 dBm  
P3dB: 31 dBm  
Output IP3: 42 dBm  
Bias Voltage: VDD = 4 V  
Bias Current: IDSQ = 2850 mA  
50 Ω Matched Input / Output  
Output Power Detector  
Die Size: 4.0 x 4.3 x 0.05 mm  
RoHS* Compliant  
GND  
5
VG  
6
VD2  
7
GND  
8
VD3  
9
VD4  
10  
GND  
11  
VD5  
12  
GND  
13  
14  
DETR  
GND  
VD1  
4
GND  
RFIN  
3
2
1
15  
16  
17  
RFOUT  
GND  
GND  
DETO  
Applications  
Satellite Communications  
Point-to-Point Communications  
Radar Front Ends  
Test and Measurement  
Automotive Radar  
28  
26  
VD1  
18  
27  
25  
24  
23  
22  
21  
20  
19  
GND  
VG  
VD2  
GND  
VD3  
VD4  
GND  
VD5  
GND  
Description  
Pin Configuration2  
The MAAP-011388-DIE is a 1 W power amplifier.  
The power amplifier operates from 71 to 86 GHz and  
provides 28 dB of linear gain (at nominal bias  
conditions) and 31 dBm of output power at 6 dB  
compression. The device is fully matched across the  
band and includes an output power detector. The  
data contained within this datasheet is probed  
directly on the die.  
1,3,15,17  
2
RF GND  
RFIN  
VD1  
RF ground  
RF Input  
4, 28  
Drain voltage 1  
DC ground  
5,8,11,13,  
19,21,24,27  
DC GND  
VG  
The MAAP-011388-DIE can be used as a power  
amplifier stage or as a driver stage in higher power  
applications.  
6,26  
7,25  
9,23  
10,22  
12,20  
14  
Gate voltage  
VD2  
Drain voltage 2  
Drain voltage 3  
Drain voltage 4  
Drain voltage 5  
This product is fabricated using a GaAs pHEMT  
process which features full passivation for enhanced  
reliability.  
VD3  
VD4  
All data was measured on die using RF probes.  
VD5  
DETR  
RFOUT  
DETO  
Detector Reference  
RF Out  
16  
Ordering Information  
18  
Detector Output  
Backside of die2  
MAAP-011388-DIE  
1. Die quantity varies.  
Gel Pack1  
2. Backside of die must be connected to RF, DC and thermal  
ground.  
* Restrictions on Hazardous Substances, compliant to current RoHS EU directive.  
1
MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.  
Visit www.macom.com for additional data sheets and product information.  
For further information and support please visit:  
https://www.macom.com/support  
DC-0028505  

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