品牌 | Logo | 应用领域 |
意法半导体 - STMICROELECTRONICS | 开关 | |
页数 | 文件大小 | 规格书 |
11页 | 260K | |
描述 | ||
QUAD BILATERAL SWITCH |
是否Rohs认证: | 符合 | 生命周期: | Obsolete |
零件包装代码: | DIP | 包装说明: | DIP, DIP14,.3 |
针数: | 14 | Reach Compliance Code: | compliant |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.66 |
模拟集成电路 - 其他类型: | SPST | JESD-30 代码: | R-PDIP-T14 |
JESD-609代码: | e3 | 正常位置: | NO |
信道数量: | 1 | 功能数量: | 4 |
端子数量: | 14 | 标称断态隔离度: | 50 dB |
通态电阻匹配规范: | 16 Ω | 最大通态电阻 (Ron): | 320 Ω |
最高工作温度: | 125 °C | 最低工作温度: | -55 °C |
输出: | SEPARATE OUTPUT | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | DIP | 封装等效代码: | DIP14,.3 |
封装形状: | RECTANGULAR | 封装形式: | IN-LINE |
峰值回流温度(摄氏度): | NOT SPECIFIED | 电源: | 2/12 V |
认证状态: | Not Qualified | 座面最大高度: | 5.1 mm |
子类别: | Multiplexer or Switches | 最大供电电压 (Vsup): | 12 V |
最小供电电压 (Vsup): | 2 V | 标称供电电压 (Vsup): | 4.5 V |
表面贴装: | NO | 最长断开时间: | 30 ns |
最长接通时间: | 20 ns | 切换: | BREAK-BEFORE-MAKE |
技术: | CMOS | 温度等级: | MILITARY |
端子面层: | Matte Tin (Sn) | 端子形式: | THROUGH-HOLE |
端子节距: | 2.54 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 7.62 mm |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
74HC4016N,652 | NXP |
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