生命周期: | Obsolete | 零件包装代码: | BGA |
包装说明: | TBGA, | 针数: | 64 |
Reach Compliance Code: | compliant | ECCN代码: | 3A991.B.1.A |
HTS代码: | 8542.32.00.51 | 风险等级: | 5.84 |
最长访问时间: | 80 ns | 备用内存宽度: | 8 |
JESD-30 代码: | R-PBGA-B64 | 长度: | 13 mm |
内存密度: | 268435456 bit | 内存集成电路类型: | FLASH |
内存宽度: | 16 | 功能数量: | 1 |
端子数量: | 64 | 字数: | 16777216 words |
字数代码: | 16000000 | 工作模式: | ASYNCHRONOUS |
最高工作温度: | 70 °C | 最低工作温度: | |
组织: | 16MX16 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TBGA | 封装形状: | RECTANGULAR |
封装形式: | GRID ARRAY, THIN PROFILE | 并行/串行: | PARALLEL |
编程电压: | 3 V | 认证状态: | Not Qualified |
座面最大高度: | 1.2 mm | 最大供电电压 (Vsup): | 3.6 V |
最小供电电压 (Vsup): | 2.7 V | 标称供电电压 (Vsup): | 3 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | COMMERCIAL | 端子形式: | BALL |
端子节距: | 1 mm | 端子位置: | BOTTOM |
宽度: | 11 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
K8P5516UZB-EE4E0 | SAMSUNG |
获取价格 |
Flash, 16MX16, 80ns, PBGA64, 11 X 13 MM, 1 MM PITCH, LEAD FREE, FBGA-64 | |
K8P5516UZB-EI4E0 | SAMSUNG |
获取价格 |
Flash, 16MX16, 80ns, PBGA64, 11 X 13 MM, 1 MM PITCH, LEAD FREE, FBGA-64 | |
K8P5516UZB-EI4ET | SAMSUNG |
获取价格 |
EEPROM Card, 16MX16, 80ns, Parallel, CMOS, PBGA64, | |
K8P5516UZB-PC4E0 | SAMSUNG |
获取价格 |
Flash, 16MX16, 80ns, PDSO56, 20 X 14 MM, LEAD FREE, TSOP1-56 | |
K8P5516UZB-PE4E0 | SAMSUNG |
获取价格 |
Flash, 16MX16, 80ns, PDSO56, 20 X 14 MM, LEAD FREE, TSOP1-56 | |
K8P5516UZB-PE4ET | SAMSUNG |
获取价格 |
Flash, 16MX16, 80ns, PDSO56, | |
K8P5516UZB-PI4E0 | SAMSUNG |
获取价格 |
Flash, 16MX16, 80ns, PDSO56, 20 X 14 MM, LEAD FREE, TSOP1-56 | |
K8P5615UQA-DE4D0 | SAMSUNG |
获取价格 |
Flash, 16MX16, 70ns, PBGA84, 11.60 X 8 MM, LEAD FREE, FBGA-84 | |
K8P5615UQA-DE4DT | SAMSUNG |
获取价格 |
EEPROM Card, 16MX16, 70ns, Parallel, CMOS, PBGA84 | |
K8P5615UQA-DI4D0 | SAMSUNG |
获取价格 |
Flash, 16MX16, 70ns, PBGA84, 11.60 X 8 MM, LEAD FREE, FBGA-84 |