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K6R3024V1D-HI12 PDF预览

K6R3024V1D-HI12

更新时间: 2024-11-01 22:16:47
品牌 Logo 应用领域
三星 - SAMSUNG 存储内存集成电路静态存储器
页数 文件大小 规格书
9页 175K
描述
128K x 24 Bit High-Speed CMOS Static RAM(3.3V Operating)

K6R3024V1D-HI12 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:BGA包装说明:BGA, BGA119,7X17,50
针数:119Reach Compliance Code:compliant
ECCN代码:3A991.B.2.AHTS代码:8542.32.00.41
风险等级:5.92Is Samacsys:N
最长访问时间:12 nsI/O 类型:COMMON
JESD-30 代码:R-PBGA-B119长度:22 mm
内存密度:3145728 bit内存集成电路类型:SRAM MODULE
内存宽度:24功能数量:1
端子数量:119字数:131072 words
字数代码:128000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:128KX24输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:BGA
封装等效代码:BGA119,7X17,50封装形状:RECTANGULAR
封装形式:GRID ARRAY并行/串行:PARALLEL
峰值回流温度(摄氏度):240电源:3.3 V
认证状态:Not Qualified最大待机电流:0.015 A
最小待机电流:3 V子类别:SRAMs
最大压摆率:0.13 mA最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):3 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子形式:BALL
端子节距:1.27 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:30宽度:14 mm
Base Number Matches:1

K6R3024V1D-HI12 数据手册

 浏览型号K6R3024V1D-HI12的Datasheet PDF文件第2页浏览型号K6R3024V1D-HI12的Datasheet PDF文件第3页浏览型号K6R3024V1D-HI12的Datasheet PDF文件第4页浏览型号K6R3024V1D-HI12的Datasheet PDF文件第5页浏览型号K6R3024V1D-HI12的Datasheet PDF文件第6页浏览型号K6R3024V1D-HI12的Datasheet PDF文件第7页 
for AT&T  
CMOS SRAM  
K6R3024V1D  
Document Title  
128Kx24 Bit High-Speed CMOS Static RAM(3.3V Operating)  
Operated at Commercial and Industrial Temperature Ranges.  
Revision History  
Rev.No.  
History  
Remark  
Draft Data  
Rev. 0.0  
Rev. 0.1  
Design-In Specification  
Pin Configurations Modified ( page 2 )  
Add Timing Diagram page 6 ~ 8 )  
Design-In  
Preliminary  
Dec. 05. 2000  
Mar. 07. 2001  
Rev. 0.2  
Rev. 0.3  
Modified Read Cycle Timing(2)  
1) Version change from M to D  
Preliminary  
Preliminary  
April. 04.2001  
June. 23.2001  
2) Cin from 20 to 15 pF  
3) Icc from 300 to 170mA for 9ns products  
from 270 to 150mA for 10ns products  
from 240 to 130mA for 12ns products  
4) Isb ( TTL ) from 120 to 40 mA for all products  
( CMOS ) from 30 to 15 mA for all products  
5) Part number change from -9 to -09 for 9ns products  
Change write parameter( tDW) from 6ns to 5ns at -10  
Final Specification Release  
Rev. 0.4  
Rev. 1.0  
Preliminary  
Final  
Oct. 31. 2001  
Dec. 19. 2001  
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the  
specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters of this device. If you have any questions,  
please contact the SAMSUNG branch office near your office, call or contact Headquarters.  
Revision 1.0  
December 2001  
- 1 -  

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