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K6F1016U4C-EF55 PDF预览

K6F1016U4C-EF55

更新时间: 2024-11-29 22:21:23
品牌 Logo 应用领域
三星 - SAMSUNG 存储内存集成电路静态存储器
页数 文件大小 规格书
9页 175K
描述
64K x16 bit Super Low Power and Low Voltage Full CMOS Static RAM

K6F1016U4C-EF55 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:BGA包装说明:VFBGA, BGA48,6X8,30
针数:48Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8542.32.00.41
风险等级:5.89Is Samacsys:N
最长访问时间:55 nsI/O 类型:COMMON
JESD-30 代码:R-PBGA-B48JESD-609代码:e0
长度:7 mm内存密度:1048576 bit
内存集成电路类型:STANDARD SRAM内存宽度:16
功能数量:1端子数量:48
字数:65536 words字数代码:64000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:64KX16
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:VFBGA封装等效代码:BGA48,6X8,30
封装形状:RECTANGULAR封装形式:GRID ARRAY, VERY THIN PROFILE, FINE PITCH
并行/串行:PARALLEL峰值回流温度(摄氏度):NOT SPECIFIED
电源:3 V认证状态:Not Qualified
座面最大高度:1 mm最大待机电流:0.000005 A
最小待机电流:1.5 V子类别:SRAMs
最大压摆率:0.026 mA最大供电电压 (Vsup):3.3 V
最小供电电压 (Vsup):2.7 V标称供电电压 (Vsup):3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:BALL端子节距:0.75 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:6 mmBase Number Matches:1

K6F1016U4C-EF55 数据手册

 浏览型号K6F1016U4C-EF55的Datasheet PDF文件第2页浏览型号K6F1016U4C-EF55的Datasheet PDF文件第3页浏览型号K6F1016U4C-EF55的Datasheet PDF文件第4页浏览型号K6F1016U4C-EF55的Datasheet PDF文件第5页浏览型号K6F1016U4C-EF55的Datasheet PDF文件第6页浏览型号K6F1016U4C-EF55的Datasheet PDF文件第7页 
K6F1016U4C Family  
CMOS SRAM  
Document Title  
64K x16 bit Super Low Power and Low Voltage Full CMOS Static RAM  
Revision History  
Revision No. History  
Draft Date  
Remark  
0.0  
Initial Draft  
May 17, 2001  
Preliminary  
1.0  
Finalize  
September 27, 2001 Final  
- Changed 48-TBGA vertical dimension  
E1(Typical) 0.55mm to 0.58mm  
E2(Typical) 0.35mm to 0.32mm  
2.0  
Revised  
September 15, 2003 Final  
- Added Lead Free product(K6F1016U4C-AF55/AF70) in PRODUCT  
LIST  
The attached datasheets are provided by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the specifications and  
products. SAMSUNG Electronics will answer to your questions about device. If you have any questions, please contact the SAMSUNG branch offices.  
Revision 2.0  
- 1 -  
September 2003  

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