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K6F1616R6B-EF70T PDF预览

K6F1616R6B-EF70T

更新时间: 2024-11-30 21:13:19
品牌 Logo 应用领域
三星 - SAMSUNG 静态存储器内存集成电路
页数 文件大小 规格书
9页 131K
描述
Standard SRAM, 1MX16, 70ns, CMOS, PBGA48

K6F1616R6B-EF70T 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:FBGA, BGA48,6X8,30Reach Compliance Code:compliant
风险等级:5.92最长访问时间:70 ns
I/O 类型:COMMONJESD-30 代码:R-PBGA-B48
内存密度:16777216 bit内存集成电路类型:STANDARD SRAM
内存宽度:16湿度敏感等级:1
端子数量:48字数:1048576 words
字数代码:1000000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:1MX16输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:FBGA
封装等效代码:BGA48,6X8,30封装形状:RECTANGULAR
封装形式:GRID ARRAY, FINE PITCH并行/串行:PARALLEL
峰值回流温度(摄氏度):225电源:1.8 V
认证状态:Not Qualified最小待机电流:1 V
子类别:SRAMs最大压摆率:0.022 mA
标称供电电压 (Vsup):1.8 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子形式:BALL端子节距:0.75 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
Base Number Matches:1

K6F1616R6B-EF70T 数据手册

 浏览型号K6F1616R6B-EF70T的Datasheet PDF文件第2页浏览型号K6F1616R6B-EF70T的Datasheet PDF文件第3页浏览型号K6F1616R6B-EF70T的Datasheet PDF文件第4页浏览型号K6F1616R6B-EF70T的Datasheet PDF文件第5页浏览型号K6F1616R6B-EF70T的Datasheet PDF文件第6页浏览型号K6F1616R6B-EF70T的Datasheet PDF文件第7页 
K6F1616R6B Family  
CMOS SRAM  
Document Title  
1M x16 bit Super Low Power and Low Voltage Full CMOS Static RAM  
Revision History  
Revision No. History  
Draft Date  
Remark  
0.0  
Initial draft  
July 29, 2002  
Preliminary  
0.1  
Finalize  
August 21, 2003  
Final  
- Added 55ns speed bin  
- Changed Icc2(@70ns) : 25mA to 22mA  
- Changed Package Coplanarity from 0.08mm to 0.10mm  
The attached datasheets are provided by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the specifications and  
products. SAMSUNG Electronics will answer to your questions about device. If you have any questions, please contact the SAMSUNG branch offices.  
1
Revision 1.0  
August 2003  

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