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K6F1016V4B-FF55T PDF预览

K6F1016V4B-FF55T

更新时间: 2024-11-11 20:10:47
品牌 Logo 应用领域
三星 - SAMSUNG 静态存储器内存集成电路
页数 文件大小 规格书
9页 158K
描述
Standard SRAM, 64KX16, 55ns, CMOS, PBGA48

K6F1016V4B-FF55T 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:FBGA, BGA48,6X8,30Reach Compliance Code:compliant
风险等级:5.92最长访问时间:55 ns
I/O 类型:COMMONJESD-30 代码:R-PBGA-B48
JESD-609代码:e0内存密度:1048576 bit
内存集成电路类型:STANDARD SRAM内存宽度:16
端子数量:48字数:65536 words
字数代码:64000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:64KX16输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:FBGA
封装等效代码:BGA48,6X8,30封装形状:RECTANGULAR
封装形式:GRID ARRAY, FINE PITCH并行/串行:PARALLEL
电源:3.3 V认证状态:Not Qualified
最大待机电流:0.000001 A最小待机电流:1.5 V
子类别:SRAMs最大压摆率:0.04 mA
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:Tin/Lead (Sn/Pb)端子形式:BALL
端子节距:0.75 mm端子位置:BOTTOM
Base Number Matches:1

K6F1016V4B-FF55T 数据手册

 浏览型号K6F1016V4B-FF55T的Datasheet PDF文件第2页浏览型号K6F1016V4B-FF55T的Datasheet PDF文件第3页浏览型号K6F1016V4B-FF55T的Datasheet PDF文件第4页浏览型号K6F1016V4B-FF55T的Datasheet PDF文件第5页浏览型号K6F1016V4B-FF55T的Datasheet PDF文件第6页浏览型号K6F1016V4B-FF55T的Datasheet PDF文件第7页 
Preliminary  
K6F1016V4B Family  
CMOS SRAM  
Document Title  
64K x16 bit Super Low Power and Low Voltage Full CMOS Static RAM  
Revision History  
Revision No. History  
0.0 Initial Draft  
Draft Date  
Remark  
May 8, 2000  
Preliminary  
The attached datasheets are provided by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the specifications and  
products. SAMSUNG Electronics will answer to your questions about device. If you have any questions, please contact the SAMSUNG branch offices.  
Revision 0.0  
May 2000  
- 1 -  

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