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K4S643232F-TL70 PDF预览

K4S643232F-TL70

更新时间: 2024-01-22 04:40:16
品牌 Logo 应用领域
三星 - SAMSUNG 存储内存集成电路光电二极管动态存储器时钟
页数 文件大小 规格书
12页 103K
描述
2M x 32 SDRAM 512K x 32bit x 4 Banks Synchronous DRAM LVTTL

K4S643232F-TL70 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:TSOP2包装说明:TSOP2, TSSOP86,.46,20
针数:86Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8542.32.00.02
风险等级:5.89Is Samacsys:N
访问模式:FOUR BANK PAGE BURST最长访问时间:5.5 ns
其他特性:AUTO/SELF REFRESH最大时钟频率 (fCLK):143 MHz
I/O 类型:COMMON交错的突发长度:1,2,4,8
JESD-30 代码:R-PDSO-G86JESD-609代码:e0
长度:22.22 mm内存密度:67108864 bit
内存集成电路类型:SYNCHRONOUS DRAM内存宽度:32
功能数量:1端口数量:1
端子数量:86字数:2097152 words
字数代码:2000000工作模式:SYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:2MX32输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:TSOP2
封装等效代码:TSSOP86,.46,20封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE峰值回流温度(摄氏度):NOT SPECIFIED
电源:3.3 V认证状态:Not Qualified
刷新周期:4096座面最大高度:1.2 mm
自我刷新:YES连续突发长度:1,2,4,8,FP
最大待机电流:0.002 A子类别:DRAMs
最大压摆率:0.14 mA最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):3 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:GULL WING端子节距:0.5 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:10.16 mmBase Number Matches:1

K4S643232F-TL70 数据手册

 浏览型号K4S643232F-TL70的Datasheet PDF文件第4页浏览型号K4S643232F-TL70的Datasheet PDF文件第5页浏览型号K4S643232F-TL70的Datasheet PDF文件第6页浏览型号K4S643232F-TL70的Datasheet PDF文件第8页浏览型号K4S643232F-TL70的Datasheet PDF文件第9页浏览型号K4S643232F-TL70的Datasheet PDF文件第10页 
K4S643232F  
CMOS SDRAM  
DC CHARACTERISTICS  
(Recommended operating condition unless otherwise noted, TA = 0 to 70°C, VIH(min)/VIL(max)=2.0V/0.8V)  
Speed  
-45 -50 -55 -60 -70  
CAS  
Latency  
Parameter  
Symbol  
Test Condition  
Unit Note  
3
2
140 140 140  
130 130  
Operating Current  
(One Bank Active)  
Burst Length =1  
ICC1  
mA  
mA  
2
tRC ³ tRC(min), tCC ³ tCC(min), Io = 0mA  
110  
2
ICC2P  
CKE £ VIL(max), tCC = 15ns  
Precharge Standby Current in  
power-down mode  
ICC2PS  
CKE & CLK £ VIL(max), tCC = ¥  
CKE ³ VIH(min), CS ³ VIH(min), tCC = 15ns  
2
ICC2N  
12  
7
Input signals are changed one time during 30ns  
Precharge Standby Current  
in non power-down mode  
mA  
mA  
mA  
CKE ³ VIH(min), CLK £ VIL(max), tCC = ¥  
Input signals are stable  
ICC2NS  
ICC3P  
CKE £ VIL(max), tCC = 15ns  
CKE £ VIL(max), tCC = ¥  
4
4
Active Standby Current  
in power-down mode  
ICC3PS  
CKE ³ VIH(min), CS ³ VIH(min), tCC = 15ns  
Input signals are changed one time during 30ns  
ICC3N  
40  
35  
Active Standby Current  
in non power-down mode  
(One Bank Active)  
CKE ³ VIH(min), CLK £ VIL(max), tCC = ¥  
Input signals are stable  
ICC3NS  
3
2
3
2
180 170 160  
150 140  
140 120  
Operating Current  
(Burst Mode)  
Io = 0 mA, Page Burst  
All bank Activated, tCCD = tCCD(min)  
ICC4  
ICC5  
ICC6  
mA  
mA  
2
3
120  
150 150 150  
Refresh Current  
tRC ³ tRC(min)  
CKE £ 0.2V  
120  
2
mA  
uA  
4
5
Self Refresh Current  
450  
Notes :  
1. Unless otherwise notes, Input level is CMOS(VIH/VIL=VDDQ/VSSQ) in LVTTL.  
2. Measured with outputs open.  
3. Refresh period is 64ms.  
4. K4S643232F-TC**  
5. K4S643232F-TL**  
Rev. 1.0 (Jan. 2002)  
- 7 -  

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