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IXFH52N30Q PDF预览

IXFH52N30Q

更新时间: 2024-11-17 22:47:59
品牌 Logo 应用领域
IXYS 栅极
页数 文件大小 规格书
2页 73K
描述
N-Channel Enhancement Mode Avalanche Rated, High dv/dt, Low t Low Gate Charge and Capacitances

IXFH52N30Q 技术参数

是否无铅: 不含铅生命周期:Transferred
零件包装代码:TO-247包装说明:TO-247, 3 PIN
针数:3Reach Compliance Code:unknown
ECCN代码:EAR99风险等级:8.5
其他特性:AVALANCHE RATED雪崩能效等级(Eas):1500 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:300 V最大漏极电流 (Abs) (ID):52 A
最大漏极电流 (ID):52 A最大漏源导通电阻:0.06 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-247
JESD-30 代码:R-PSFM-T3JESD-609代码:e1
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):360 W
最大脉冲漏极电流 (IDM):208 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:NO
端子面层:Tin/Silver/Copper (Sn/Ag/Cu)端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管元件材料:SILICONBase Number Matches:1

IXFH52N30Q 数据手册

 浏览型号IXFH52N30Q的Datasheet PDF文件第2页 
HiPerFETTM  
Power MOSFETs  
Q-Class  
IXFH 52N30Q  
IXFK 52N30Q  
IXFT 52N30Q  
VDSS = 300 V  
ID25 = 52 A  
RDS(on) = 60 mW  
trr  
£ 250 ns  
N-Channel Enhancement Mode  
Avalanche Rated, High dv/dt, Low trr  
Low Gate Charge and Capacitances  
Preliminary data  
Symbol  
TestConditions  
Maximum Ratings  
TO-247AD(IXFH)  
VDSS  
VDGR  
TJ = 25°C to 150°C  
TJ = 25°C to 150°C; RGS = 1 MW  
300  
300  
V
V
VGS  
VGSM  
Continuous  
Transient  
±20  
±30  
V
V
(TAB)  
ID25  
IDM  
IAR  
TC = 25°C, Chip capability  
TC = 25°C, pulse width limited by TJM  
TC = 25°C  
52  
208  
52  
A
A
A
TO-268 (D3) ( IXFT)  
EAR  
EAS  
TC = 25°C  
TC = 25°C  
30  
1.5  
mJ  
J
G
(TAB)  
dv/dt  
IS £ IDM, di/dt £ 100 A/ms, VDD £ VDSS  
TJ £ 150°C, RG = 2 W  
,
5
V/ns  
S
PD  
TC = 25°C  
360  
W
TJ  
TJM  
Tstg  
-55 ... +150  
150  
-55 ... +150  
°C  
°C  
°C  
TO-264AA(IXF
TL  
1.6 mm (0.063 in) from case for 10 s  
300  
°C  
G
D
Md  
Mountingtorque  
TO-247  
TO-264  
1.13/10 Nm/lb.in.  
0.9/6 Nm/lb.in.  
S
D (TAB)  
Weight  
Symbol  
TO-247  
TO-264  
TO-268  
6
10  
4
g
g
g
G = Gate  
S = Source  
TAB = Drain  
Features  
• Low gate charge  
TestConditions  
CharacteristicValues  
• Internationalstandardpackages  
• EpoxymeetUL94V-0,flammability  
classification  
(TJ = 25°C, unless otherwise specified)  
min. typ. max.  
• Low RDS (on) HDMOSTM process  
• Rugged polysilicon gate cell structure  
• Avalanche energy and current rated  
• Fast intrinsic Rectifier  
VDSS  
VGS = 0 V, ID = 1 mA  
VDS = VGS, ID = 4 mA  
300  
2
V
V
VGS(th)  
4
IGSS  
IDSS  
VGS = ±20 VDC, VDS = 0  
±200 nA  
50 mA  
VDS = VDSS  
VGS = 0 V  
TJ = 25°C  
TJ = 125°C  
Advantages  
1
mA  
• Easy to mount  
• Space savings  
• High power density  
RDS(on)  
VGS = 10 V, ID = 0.5 • ID25  
Pulse test, t £ 300 ms, duty cycle d £ 2 %  
60 mW  
IXYS reserves the right to change limits, test conditions, and dimensions.  
© 2000 IXYS All rights reserved  
98522B(7/00)  
1 - 2  

IXFH52N30Q 替代型号

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